ACCRETECH UF190R, Руководство пользователя

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4 Wafer Mapping & Die Sampling
4-9
4: Upper-left
3: Upper-right
1: Lower-left 2: Lower-right
Target die
How to check Target Die:
With “Bottom Left” setting, it checks whether
each of the left die
→
lower die
→
lower left die
is normal die or not. The first TEG die after this
check is established as a target.
Target Sense Method
‘TEG’ targets dice different from normal pattern dice
including TEG located inside wafer map. ‘Corner’ is
selected when blank dice and TEG located outside the
wafer map (test area) are targeted. In case of corner
target, the parameters “Locating Direction of Target
Die” and “Target Search Range” becomes invalid.
Locating Direction of Target Die
When “TEG” is selected in “Target Sense Method,” the
location of the target die is specifies in the 2 x 2
checked die area (refer to the figure on the left). The
same checking is performed for corner target; however,
regardless of the settings made at this point, the corner
target is fixed depending on the corner target quadrants
(1st to 4th) according to the wafer center.
Target Search Range
Search range when the die, whose location is
determined in “Relative Coordinates X/Y (Center Origin)
for Target Sense Die” on Page 2/3, is not TEG (input
range: 0 to 50 mm).
Search
range R
R < X and Y
Index R
≧
X or
Y Index
R
≧
X and
Y Index
Device initial
Wafer Upper/Lower
,RH/LH one
Index Die Adjacent
Dice in a
dir. (more
than 2) Adjacent
Dice in
both dir.
(more than
8)
After 2nd Die Immediate
Alarm Stop Same
above Same
above
Registration of Reference Pattern
Select the automatic selection or data-in by die images,
when a new device initial wafer registers the target
sensing model pattern. If the automatic registration is
unsuccessful, the data-in operation request appears.
(Internal pattern of the normal test target die is selected
as a model image for target sensing. The die, which
does not have the same pattern as the normal test
target die, is recognized as a target.)
MAG of Reference Pattern
Used to select high or low mag for target sensing model
pattern. Normally select low mag. Low mag camera
view is 3.33 x 3.12 mm. As for small dies containing
multiple dies in this view, select high mag. (High mag
view is 0.51 x 0.48 mm.) Note that no automatic switch
between high and low mag is provided when
automatically registering the target sensing model
pattern.