NOTES:
1.
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
PACKAGE OUTLINE
4219044/C 09/2020
www.ti.com
VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
RGZ0048A
A
0.08 C
0.1
C A B
0.05
C
B
SYMM
SYMM
PIN 1 INDEX AREA
7.1
6.9
7.1
6.9
1 MAX
0.05
0.00
SEATING PLANE
C
5.15±0.1
2X 5.5
2X
5.5
44X 0.5
48X 0.5
0.3
48X 0.30
0.18
PIN1 ID
(OPTIONAL)
(0.2) TYP
1
12
13
24
25
36
37
48
(0.1) TYP
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
SEE SIDE WALL
DETAIL
CHAMFERED LEAD
CORNER LEAD OPTION
(0.45) TYP
SEE LEAD OPTION