ADV
ANCEINFORMA
TION
TMS320F28377S, TMS320F28376S, TMS320F28375S, TMS320F28374S
SPRS881A – AUGUST 2014 – REVISED JUNE 2015
• Package Options:
• Temperature Options:
– Lead-Free, Green Packaging
– T: –40ºC to 105ºC Junction
– 337-Ball New Fine Pitch Ball Grid Array
– S: –40ºC to 125ºC Junction
(nFBGA) [ZWT Suffix]
– Q: –40ºC to 125ºC Free-Air
– 176-Pin PowerPAD™ Thermally Enhanced Low-
(Q100 Qualification for Automotive Applications)
Profile Quad Flatpack (HLQFP)
[PTP Suffix]
– 100-Pin PowerPAD Thermally Enhanced Thin
Quad Flatpack (HTQFP) [PZP Suffix]
1.2
Applications
•
Industrial Drives
•
Smart Metering
•
Solar Micro Inverters and Converters
•
Automotive Transportation
•
Radar
•
Power Line Communications
•
Digital Power
•
Software-Defined Radio
2
Device Overview
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: