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WBPEEUI220772A0
Unpacking and Inspection
c.
Only after firm contact with an antistatic mat and/or
firmly gripped by grounded personnel.
3. Personnel handling assemblies with semiconductor devices
should be neutralized to a static-free workstation by a ground-
ing wrist strap connected to the station or to a good ground
point at the field sight.
4. Do not allow clothing to contact semiconductor devices.
Most clothing generates static electricity.
5. Avoid touching connectors or components.
6. Avoid partial connection of semiconductor devices. Most
devices can be damaged by floating leads, especially the power
supply connector. If an assembly must be placed in a live sys-
tem, it should be done quickly. Do not cut leads or lift circuit
paths when troubleshooting.
7. Be sure to ground any test equipment.
8. Avoid static charges during removal and replacement.
Make sure the assembly is fully clean around its leads, but do
not rub or clean with an insulating cloth.
9. Remove dust from components using an antistatic field
service vacuum.
Do not use a lead (graphite) pencil to set dipswitches. This can
contaminate switch contacts and cause the component to mal-
function.
Unpacking and Inspection
When the auxiliary terminal is received it should be unpacked
and inspected.
1. Check for any obvious damage to the crate or its contents.
If damage is evident, notify the carrier and an Elsag Bailey
sales representative.
2. Remove any loose packing from the crate.
3. Inspect the nameplate and verify the unit received matches
the desired function.
Summary of Contents for C-I-CV43C
Page 1: ...Bailey Hartmann Braun TM Instruction Conductor Conductor VMS Series 43 Auxiliary Terminal...
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Page 87: ...PR6 4 WBPEEUI220772A0 Procedure Figure PR6 3 CPU Input Voltage T00440A REAR OF CPU 230 V 115 V...
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Page 131: ...PR25 2 WBPEEUI220772A0 Procedure Figure PR25 1 Multibus Card Cage T01448A FRONT VIEW SCREWS 4...
Page 139: ...PR28 4 WBPEEUI220772A0 Procedure Figure PR28 2 PEP Replacement T01308A FRONT VIEW SCREWS 5...
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