1. Preca
1.3 ESD Precautions
Certain semiconductor devices can be easily damaged
commonly called “Electrostatically Sensitive (ES) Dev
integrated circuits some field effect transistors and se
integrated circuits, some field effect transistors, and se
The techniques outlined below should be followed to h
caused by static electricity.
Caution >>Be sure no power is applied to the chassis
1. Immediately before handling a semiconductor comp
off any electrostatic charge on your body by touchin
commercially available wrist strap device, which sho
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
such as aluminum or copper foil, or conductive foam
vicinity of the assembly.
3. Use only a grounded tip soldering iron to solder or d
4 Use only an “anti static” solder removal device Som
4. Use only an anti-static solder removal device. Som
static” can generate electrical charges sufficient to
5. Do not use Freon-propelled chemicals. When spray
damage ESDs.
6. Do not remove a replacement ESD from its protectiv
Most replacement ESDs are packaged with all leads
or a comparable conductive material.
7. Immediately before removing the protective shorting
touch the protective material to the chassis or circui
8. Maintain continuous electrical contact between the E
until completely plugged or soldered into the circuit.
9. Minimize bodily motions when handling unpackaged
the brushing together of clothing fabric and lifting on
electricity sufficient to damage an ESD
electricity sufficient to damage an ESD.
Service Manual
CLX-9250/9350 series
1-
autions
d by static electricity. Such components are
ices” or ESDs. Examples of typical ESDs are:
emiconductor “chip” components
emiconductor chip components.
help reduce the incidence of component damage
or circuit, and observe all other safety precautions.
ponent or semiconductor-equipped assembly, drain
ng a known earth ground. Alternatively, employ a
f
f
ould be removed for your personal safety reasons
h ESDs, place the assembly on a conductive surface,
m, to prevent electrostatic charge buildup in the
desolder ESDs.
me solder removal devices not classified as “anti
me solder removal devices not classified as anti-
damage ESDs.
yed, these can generate electrical charges sufficient to
ve packaging until immediately before installing it.
s shorted together by conductive foam, aluminum foil,
g material from the leads of a replacement ESD,
t assembly into which the device will be installed.
ESD and the assembly into which it will be installed,
d replacement ESDs. Normal motions, such as
ne’s foot from a carpeted floor, can generate static
SAMSUNG ELECTRONICS
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