RCVDL56DPFL/SP, RCV56DPFL/SP, and RCV336DPFL/SP Designer’s Guide
iv
1119
6.8 CLEARDOWN ...................................................................................................................................6-10
6.8.1 K56flex Cleardown ............................................................................................................ 6-10
6.8.2 V.34 Cleardown................................................................................................................. 6-10
6.8.3 V.32 bis Cleardown ........................................................................................................... 6-10
7. DESIGN CONSIDERATIONS ..........................................................................................................................7-1
7.1 PC BOARD LAYOUT GUIDELINES .....................................................................................................7-1
7.2 ELECTROMAGNETIC INTERFERENCE (EMI) CONSIDERATIONS ....................................................7-3
7.3 CRYSTAL SPECIFICATIONS ..............................................................................................................7-5
7.4 RECOMMENDED INTERFACE CIRCUITS ..........................................................................................7-6
7.5 PACKAGE DIMENSIONS .................................................................................................................. 7-10
8. T.30 IMPLEMENTATION.................................................................................................................................8-1
8.1 GENERAL ...........................................................................................................................................8-1
8.1.1 Phase A ..............................................................................................................................8-1
8.1.2 Phase B ..............................................................................................................................8-1
8.1.3 Phase C..............................................................................................................................8-2
8.1.4 Phase D..............................................................................................................................8-2
8.1.5 Phase E ..............................................................................................................................8-2
8.2 ERROR CORRECTION MODE............................................................................................................8-2
8.2.1 General...............................................................................................................................8-2
8.2.2 ECM Frame Structure ...................................................................................................... .8-22
8.3 SIGNAL RECOGNITION ALGORITHM ..............................................................................................8 -22
9. V.8 OPERATION CONSIDERATIONS .............................................................................................................9-1
9.1 V.8 ORIGINATING MODEM OPERATING PROCEDURE ....................................................................9-1
9.1.1 Originating Without CI Option (Default)................................................................................9- 1
9.1.2 Originating With CI Option............................................................................................... ....9-1
9.2 V.8 ANSWERING MODEM OPERATING PROCEDURE......................................................................9-1
9.3 V.8 AND AUTOMODE .........................................................................................................................9-4
9.4 HANDSHAKE MONITORING...............................................................................................................9-5
9.4.1 V.8 Octet Monitoring ..................................................................................................... ......9-5
10. V.8bis..................................................................................................................... ..................................... 10-1
10.1 V.8bis TRANSMITTER..................................................................................................................... 10-1
10.2 V.8bis RECEIVER............................................................................................................................10-1
11. ADPCM VOICE COMPRESSION AND DECOMPRESSION......................................................................... 11-1
11.1 ADPCM RECEIVER (RX-CODER) ................................................................................................... 11-1
11.1.1 Mode Selection ............................................................................................................... 11-1
11.1.2 Operation ........................................................................................................................ 11-1
11.2 ADPCM TRANSMITTER (TX-DECODER)........................................................................................ 11-1
11.2.1 Mode Selection ............................................................................................................... 11-1
11.2.2 Operation ........................................................................................................................ 11-1
11.3 VOICE AGC .................................................................................................................................... 11-5
11.3.1 Voice AGC Parameters ...................................................................................................11-5
Summary of Contents for RC336DPFL
Page 193: ...INSIDE BACK COVER NOTES ...