Intel® Server Boards SE7320SP2 and SE7525GP2
Functional Architecture
Revision 4.0
11
3.1.5
Common Enabling Kit (CEK) Design Support
The server board has been designed to comply with Intel’s common enabling kit (CEK)
processor mounting and heatsink retention solution. The server board will ship with a CEK
spring snapped onto the underside of the board, beneath each processor socket. The CEK
spring is removable, allowing for the use of non-Intel heatsink retention solutions.
Figure 5. CEK Processor Mounting
Heatsink assembly with
integrated hardware
Thermal Interface
Material (TIM)
Server
board
CEK Spring
Chassis
Summary of Contents for SE7320SP2 - 800MHZ Ecc Ddr Xeon
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