Intel® Server Boards SE7320SP2 and SE7525GP2
General Specifications
Revision 4.0
161
8. General
Specifications
8.1 Absolute Maximum Ratings
Operating either server board at conditions beyond those shown in the following table may
cause permanent damage to the system. The table is provided for stress testing purposes only.
Exposure to absolute maximum rating conditions for extended periods may affect system
reliability.
Table 99. Absolute Maximum Ratings
Operating Temperature
0 degrees C to 55 degrees C
Non-operating Temperature
-40 degrees C to +70 degrees C
Voltage on any signal with respect to ground
-0.3 V to Vdd + 0.3V
3.3 V Supply Voltage with Respect to ground
-0.3 V to 3.63 V
5 V Supply Voltage with Respect to ground
-0.3 V to 5.5 V
Notes:
Chassis design must provide proper airflow to avoid exceeding Intel
®
Xeon
®
processor maximum case temperature.
VDD means supply voltage for the device
Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery
components which need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation can
not be held responsible, if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
8.2 Mean Time Between Failure (MTBF)
Intel has calculated the MTBF for the server boards as follows:
Table 100. MTBF Calculation
Ambient Temperature
MTBF Calculation
55° C
97,164
40° C
108,598
Summary of Contents for SE7320SP2 - 800MHZ Ecc Ddr Xeon
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