Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011, Specifications

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6 Thermal/Mechanical Specifications and Design Guidelines
6-4 Thermal Test Vehicle Thermal Profile for Intel
®
Core™ i5-2000 and i3-2000 Desktop
Processor Series (Dual Core 35W) ...........................................................................47
6-5 TTV Case Temperature (TCASE) Measurement Location ..............................................52
6-6 Frequency and Voltage Ordering ..............................................................................55
6-7 Package Power Control ...........................................................................................59
8-1 Comparison of Case Temperature versus Sensor Based Specification ............................64
8-2 Intel
®
Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)
Thermal Profile......................................................................................................65
8-3 Thermal solution Performance .................................................................................66
8-4 Example: Required YCA for Various TAMBIENT Conditions ...........................................67
8-5 Thermal Solution Performance versus Fan Speed .......................................................69
8-6 Fan Response Without TAMBIENT Data .....................................................................71
8-7 Fan Response with TAMBIENT Aware FSC..................................................................72
8-8 DTS 1.1 Definition Points ........................................................................................74
8-9 Fan Response Comparison with Various Fan Speed Control Options ..............................76
9-1 ATX Heatsink Reference Design Assembly .................................................................80
9-2 ATX KOZ 3-D Model Primary (Top) Side ....................................................................81
9-3 RCBFH Extrusion ...................................................................................................82
9-4 Clip for Existing Solutions to straddle LGA1155 Socket................................................83
9-5 Core ....................................................................................................................84
9-6 Clip Core and Extrusion Assembly ............................................................................85
9-7 Critical Parameters for Interface to the Reference Clip ................................................85
9-8 Critical Core Dimensions .........................................................................................86
9-9 TTV Die Size and Orientation ...................................................................................87
11-1 Mechanical Representation of the Boxed Processor .....................................................94
11-2 Space Requirements for the Boxed Processor (side view) ............................................95
11-3 Space Requirements for the Boxed Processor (top view) .............................................95
11-4 Space Requirements for the Boxed Processor (overall view) ........................................96
11-5 Boxed Processor Fan Heatsink Power Cable Connector Description................................97
11-6 Baseboard Power Header Placement Relative to Processor Socket.................................98
11-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) .....................99
11-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)....................99
11-9 Boxed Processor Fan Heatsink Set Points ................................................................ 100