Thermal Solution Quality and Reliability Requirements
90
Thermal/Mechanical Specifications and Design Guidelines
10.2.1
Recommended Test Sequence
Each test sequence should start with components (that is, baseboard, heatsink
assembly, and so on) that have not been previously submitted to any reliability testing.
Prior to the mechanical shock & vibration test, the units under test should be
preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation
during burn-in stage.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/Processor/memory test.
10.2.2
Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification
can be met.
10.2.3
Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational baseboard that has not been exposed to any
battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or
connected:
• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors.
Intel PC
Diags
is an example of software that can be utilized for this test.
Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
