Thermal/Mechanical Specifications and Design Guidelines
65
Sensor Based Thermal Specification Design Guidance
8.2
Sensor Based Thermal Specification
The sensor based thermal specification consists of two parts. The first is a thermal
profile that defines the maximum TTV T
CASE
as a function of TTV power dissipation. The
thermal profile defines the boundary conditions for validation of the thermal solution.
The second part is a defined thermal solution performance (
CA
) as a function of the
DTS value as reported over the PECI bus when DTS is greater than T
CONTROL
. This
defines the operational limits for the processor using the TTV validated thermal
solution.
8.2.1
TTV Thermal Profile
For the sensor based specification, the only reference made to a case temperature
measurement is on the TTV. Functional thermal validation will not require the user to
apply a thermocouple to the processor package or measure processor power.
Note:
All functional compliance testing will be based on fan speed response to the reported
DTS values above T
CONTROL
. As a result, no conversion of TTV T
CASE
to processor T
CASE
will be necessary.
A knowledge of the system boundary conditions is necessary to perform the heatsink
validation.
will provide more detail on defining the boundary conditions.
The TTV is placed in the socket and powered to the recommended value to simulate the
TDP condition. See
for an example of the Intel
®
Core™ i7-2000 and i5-2000
desktop processor series (Quad Core 95W) TTV thermal profile.
Note:
This graph is provided as a reference, the complete thermal specification is in
.
Figure 8-2. Intel
®
Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)
Thermal Profile
TTV Thermal Profile
Y = Power x 0.29 + 45.1
40.0
45.0
50.0
55.0
60.0
65.0
70.0
75.0
0
20
40
60
80
100
TTV Power (W)
T
T
V
C
ase
T
em
p
er
at
u
re (°C
)
Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
