Thermal/Mechanical Specifications and Design Guidelines
107
Mechanical Drawings
Figure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)
(78.25
)
(36.00
)
(18.72
)
37.54
0.00
25.81
13.67
35.21
35.21
40.71
13.67
4X
6.00
4X
10.00
(61.02
)
4X R
1.8
(52.00
)
26.00
0.00
10.80
7.05
26.00
18.00
18.00
9.36
9.36
(27.33
)
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
SIZE
DRAWING NUMBER
REV
A1
E21319_REV_L_PAE
L
SCALE:
1.000
DO NOT SCALE DRAWING
SHEET
2
OF
2
BOARD SECONDARY SIDE
2
2
WEST
EAST
SOUTH
NORTH
SOCKET
& PROCESSOR
VOLUMETRIC KEEP-IN
INTEL PN E21320
COMPONENT VOLUMETRIC
KEEPINS
SOCKET
& PROCESSOR
VOLUMETRIC KEEP-IN OUTLINE
ROUTING KEEPOUTS
LEGEND
COMPONENT
KEEP-OUT
ROUTING AND COMPONENT KEEP-OUT
MAX COMPONENT HEIGHT 2.54MM
Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
