Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011, Specifications

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LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
40 Thermal/Mechanical Specifications and Design Guidelines
5.5 Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this section are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in
Figure 5-1 .
A detailed description of this methodology can be found at: ftp://download.intel.com/
technology/itj/q32000/pdf/reliability.pdf.
§
Figure 5-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
Freeze stressing
requirements and perform
additional data turns