LGA1155 Socket
22
Thermal/Mechanical Specifications and Design Guidelines
3.1.1
Suggested Silkscreen Marking for Socket Identification
Intel is recommending that customers mark the socket name approximately where
shown in
3.2
Attachment to Motherboard
The socket is attached to the motherboard by 1155 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, and so on) to attach the
socket.
As indicated in
, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
Figure 3-4. Suggested Board Marking
Figure 3-5. Attachment to Motherboard
Load plate
Frame
Load Lever
Back Plate
Shoulder
Screw
Load plate
Frame
Load Lever
Back Plate
Shoulder
Screw
Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
