Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011, Specifications

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Thermal/Mechanical Specifications and Design Guidelines 103
Component Suppliers
A Component Suppliers
Note: The part numbers listed below identifies the reference components. End-users are
responsible for the verification of the Intel enabled component offerings with the
supplier. These vendors and devices are listed by Intel as a convenience to Intel's
general customer base, but Intel does not make any representations or warranties
whatsoever regarding quality, reliability, functionality, or compatibility of these devices.
Customers are responsible for thermal, mechanical, and environmental validation of
these solutions. This list and/or these devices may be subject to change without notice.
Note: Individual ILM covers are made availble for post-sales support
Table A-1. Reference Heatsink
Item Intel PN Delta Foxconn Nidec
2011D Heatsink
Assembly
RCFH7-1156 (DHA-A)
E41759-002 DTC-DAA07 1A01C7T00-
DHA_XA02
F90T12MS1Z7-
64A01A1
2011C Heatsink
Assembly
RCFH6-1156 (DHA-B)
E41997-002 DTC-DAB03 1A01C7T00-
DHB_XA02
F90T12MS1Z7-
64A01B1
Table A-2. Reference Heatsink Components
Item Intel PN AVC ITW
Clip E36830-001 A208000389 N/A
Fastener Base: C33389
Cap: C33390 N/A Base: C33389
Cap: C33390
Table A-3. LGA1155 Socket and ILM Components
Item Intel PN Foxconn Molex Tyco Lotes
LGA1155 Socket E52846-002 PE115527-
4041-01F
475962032 2069570-1 N/A
LGA115X ILM
without cover
E36142-002 PT44L61-6401 475969911 2013882-3 ACA-ZIF-078-
Y02
LGA115X ILM with
cover
G11449-001 PT44L81-6401 475968711 2069838-8 ACA-ZIF-078-
Y17
LGA115X ILM
cover only
G12451-001 012-1000-5377 475973003 1-2134503-1 ACA-ZIF-127-
K01
LGA115X ILM
Back Plate
(with Screws)
E36143-002 PT44P19-6401 475969930 2069838-2 DCA-HSK-144-
Y09