Package Mechanical & Storage Specifications
18
Thermal/Mechanical Specifications and Design Guidelines
2.2
Processor Storage Specifications
includes a list of the specifications for device storage in terms of maximum
and minimum temperatures and relative humidity. These conditions should not be
exceeded in storage or transportation.
.
Notes:
1.
Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2.
Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by
applicable JEDEC standard Non-adherence may affect processor reliability.
3.
T
ABSOLUTE
STORAGE
applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags or desiccant.
4.
Intel branded board products are certified to meet the following temperature and humidity limits that are
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not
specified for non-Intel branded boards.
5.
The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
6.
Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
SUSTAINED
STORAGE
and customer shelf life in applicable intel box and bags.
§
Table 2-4.
Storage Conditions
Parameter Description
Min
Max
Notes
T
ABSOLUTE
STORAGE
The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
subjected to for any length of time.
-55 °C
125 °C
T
SUSTAINED
STORAGE
The ambient storage temperature limit (in
shipping media) for a sustained period of time.
-5 °C
40 °C
RH
SUSTAINED
STORAGE
The maximum device storage relative humidity
for a sustained period of time.
60% @ 24 °C
TIME
SUSTAINED
STORAGE
A prolonged or extended period of time; typically
associated with customer shelf life.
0
Months
6
Months
Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
