ATX Reference Thermal Solution
86
Thermal/Mechanical Specifications and Design Guidelines
9.5
Heatsink Mass & Center of Gravity
• Total mass including plastic fan housing and fasteners <500 g.
• Assembly center of gravity <= 25.4 mm, measured from the top of the IHS.
9.6
Thermal Interface Material
A thermal interface material (TIM) provides conductivity between the IHS and heat
sink. The designs use Dow Corning TC-1996. The TIM application is 0.14 g, which will
be a nominal 20 mm diameter (~0.79 inches).
Figure 9-8. Critical Core Dimensions
R 0.40 mm max
R 0.40 mm max
Gap required to avoid
core surface blemish
during clip assembly.
Recommend 0.3 mm min.
1.00 mm min
1.00 +/- 0.10 mm
Core
2.45 +/- 0.10 mm
Dia 38.68 +/- 0.30mm
Dia 36.14 +/- 0.10 mm
Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
