NANO-ULT5 SBC
Page 67
4.8 Chassis Installation
4.8.1 Heat Spreader
WARNING:
The heat spreader installed on the NANO-ULT5 can only serve as a heat
conductor, which needs additional heat dissipation mechanism to achieve
suitable thermal condition. DO NOT put the NANO-ULT5 with the heat spreader
directly on a surface that cannot dissipate system heat, and never run the
NANO-ULT5 without the heat spreader secured to the board.
When the NANO-ULT5 is shipped, it is secured to a heat spreader with six retention
screws. The heat spreader must have a direct contact with a heat dissipation surface to
ensure stable operation. In addition, a thin layer of thermal paste has to be applied onto
the heat dissipation surface where it contacts the heat spreader. The following diagrams
show an example of a heat sink module and how it can be installed for dissipating the heat
generated from the motherboard:
Heat sink module:
Material:
Aluminum
Size:
160 mm x 200 mm x 34 mm
Summary of Contents for NANO-ULT5
Page 2: ...NANO ULT5 SBC Page II Revision Date Version Changes May 21 2019 1 00 Initial release...
Page 14: ......
Page 15: ...NANO ULT5 SBC Page 1 Chapter 1 1 Introduction...
Page 24: ...NANO ULT5 SBC Page 10 Chapter 2 2 Unpacking...
Page 28: ...NANO ULT5 SBC Page 14 Chapter 3 3 Connectors...
Page 66: ...NANO ULT5 SBC Page 52 Chapter 4 4 Installation...
Page 89: ...NANO ULT5 SBC Page 75 Chapter 5 5 BIOS...
Page 128: ...NANO ULT5 SBC Page 114 Chapter 6 6 Software Drivers...
Page 132: ...NANO ULT5 SBC Page 118 Appendix A A Regulatory Compliance...
Page 134: ...NANO ULT5 SBC Page 120 B Product Disposal Appendix B...
Page 136: ...NANO ULT5 SBC Page 122 Appendix C C BIOS Menu Options...
Page 139: ...NANO ULT5 SBC Page 125 Appendix D D Digital I O Interface...
Page 142: ...NANO ULT5 SBC Page 128 Appendix E E Watchdog Timer...
Page 145: ...NANO ULT5 SBC Page 131 Appendix F F Hazardous Materials Disclosure...