Removing a microprocessor and heat sink
Read the following important guidelines before you remove a microprocessor that is
not faulty (for example, when you are replacing the system-board assembly).
If you are not replacing a defective heat sink or microprocessor, the thermal
material on the heat sink and microprocessor will remain effective if you observe
the following precautions:
v
Carefully handle the heat sink and microprocessor when you remove or install
these components.
v
Do not touch the thermal material or otherwise allow it to become contaminated.
Notes:
v
The heat-sink FRU is packaged with the thermal material applied to the
underside.
v
You must replace the thermal material if it becomes contaminated or has come in
contact with another object other than its paired microprocessor.
v
The heat sink and the thermal material are available as separate FRUs.
To remove a microprocessor and heat sink, complete the following steps.
Microprocessor
Thermal
sensor clip
Heat-sink
1. Read the safety information that begins on page vii and “Installation guidelines”
2. If the system-board tray is installed in a chassis, remove it (see “Removing the
system-board tray from a 2U chassis” on page 75 or “Removing the
system-board tray from a 3U chassis” on page 77).
Chapter 4. Removing and replacing server components
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