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4.
Remove the fan/heat sink assembly (5).
CAUTION:
When lifting the heat sink out of the computer, be careful not to bend the arm that connects
the fans.
Discrete models:
UMA models:
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the thermal module, processor, and system board spare part kits.
Discrete graphics models:
●
Various thermal pads are used on the system board components and the heat sink sections and that
service them. See the following image for thermal pad locations.
40
Chapter 6 Removal and replacement procedures for authorized service provider parts
Summary of Contents for ZBook Studio G 315-ap000 - 15ap099
Page 4: ...iv Important Notice about Customer Self Repair Parts ...
Page 6: ...vi Safety warning notice ...
Page 13: ...15 Recycling 167 Index 168 xiii ...
Page 14: ...xiv ...
Page 28: ...3 Illustrated parts catalog Computer major components 14 Chapter 3 Illustrated parts catalog ...
Page 144: ...6 Open the crash dump file 130 Chapter 7 Troubleshooting guide ...