Document Number: 002-10689 Rev *H
Page 64 of 166
S6J32E, S6J32F, S6J32G Series
WARNING:
1.
The recommended operating conditions are required to ensure the normal operation of the semiconductor device. All the
device's electrical characteristics are warranted when the device is operated under these conditions.
2.
Any use of semiconductor devices will be under their recommended operating condition.
3.
Operation under any conditions other than these conditions may adversely affect reliability of device and could result in
device failure.
4.
No warranty is made with respect to any use, operating conditions or combinations not represented on this datasheet. If
you are considering application under any conditions other than listed herein, contact a sales representative before you
implement the settings.
Notes:
−
T
A
: Ambient temperature (JEDEC)
−
T
C
: Case temperature (JEDEC), the maximum measured temperature of package case top.
−
Both rating of T
A
and T
C
should simultaneously be satisfied as maximum operation temperature.
−
The following conditions should be satisfied to facilitate heat dissipation.
1. Four or more layers PCB should be used.
2. The area of PCB should be 114.3 mm x 76.2 mm or more, and the thickness should be 1.6 mm or more. (JEDEC
standard)
3. One layer of middle layers at least should be used for dedicated layer to radiate heat with residual copper rate 90%
or more. The layer can be used for system ground.
4. 35 or more of the die stage area which is exposed at back surface of package should be soldered to a part of 1
st
layer.
5. The part of 1
st
layer should be connected to the dedicated heat radiation layer with more than 10 thermal via holes.
Figure 8-1: Example Thermal via Holes on PCB.
Notes:
−
is a schematic diagram showing PCB in section.
−
in the following pages are recommended land patterns for each package series.
Thermal via holes should be placed closely and aligned with lands.
−
When thermal via holes cannot be with lands, the following are recommended as represented by
example for LEQ-216.
−
(1). Increase pattern area size as much as possible inside the package outline.
−
(2). Place thermal via holes to be with lands as close as possible.
−
0.25 mm
≤
a
≤
0.30 mm in