The Release 3 Feature Module can only be used with the
Processor Modules (517B7 and 517C7) developed for
Release 3.
CAUTION:
When replacing a Feature Module, make
sure that you have all the necessary records to
readminister the system. When the Feature Module is
replaced, all system memory is lost, and the system will
have to be readministered.
1
2
3
4
5
6
7
Affix the round (FMl, FM2, or FM3) label to the front
of the Processor Module housing.
Remove power from the system. Make sure that the
ON/OFF switch on the Power Supply Module is set to
the OFF position.
Remove the Processor Module from the system
and
rest it on a flat surface with the right (as viewed
from
the front edge) side up.
CAUTION:
Be sure to follow proper electrostatic
discharge precautions. Refer to “Static Discharge
Problems” on page 2-9.
If you are upgrading, remove the previous Feature
Module.
Align the connectors of the Feature Module with the
connectors of the Processor Module.
Snap the Feature Module into the Processor Module.
Install the Processor Module in slot 0 of the carrier.
2-74 Installing the Control Unit
Summary of Contents for administration and
Page 40: ...FIGURE 1 9 System architecture Theory of Operation 1 37 ...
Page 175: ...Top cover Front cover FIGURE 2 27 Control unit covers Testing the System 2 107 ...
Page 211: ...FIGURE 3 I A MERLIN II System Display Console The Administrator Attendant Console 3 3 ...
Page 213: ... FIGURE 3 2 A BIS 34D Console The Administrator Attendant Console 3 5 ...
Page 331: ...General Tests 4 55 Reaming the Control Unit 4 55 Testing Outside Lines 4 56 ...