Amtech TEMPRESS, Manual

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TABLE OF CONTENTS
P
ROCESS
M
ANUAL
III
4.3 Silicondioxide (LTO SiO
2
) from SiH
4
and O
2
.......................... 4.3-1
4.3.1
Basic configuration ................................................. 4.3-1
4.3.2
Description.............................................................. 4.3-1
4.3.3
Startup parameters for processing.......................... 4.3-2
4.3.4
Recommended cleaning interval ............................ 4.3-2
4.3.5
Process result indication......................................... 4.3-3
4.3.6
Gas schematic example: LPCVD LTO.................... 4.3-4
4.3.7
Recipe example: LPCVD silicondioxide from LTO SiH
4
and O
2
4.3-5
4.3.8
Troubleshooting an LTO process ........................... 4.3-8
5. Operation Instructions...................................................4.3-1
5.1 Load or Unload process wafers ............................................. 5.1-1
5.1.1
Load process wafers............................................... 5.1-1
5.1.2
Unload wafers......................................................... 5.1-1
5.2 Login TSC-2........................................................................... 5.2-1
5.2.1
TSC-2 ..................................................................... 5.2-1
5.3 Selecting a new process recipe ............................................. 5.3-1
5.3.1
Touchscreen ........................................................... 5.3-1
5.3.2
TSC-2 ..................................................................... 5.3-3
5.4 Start/Continue a new process recipe ..................................... 5.4-1
5.4.1
Touchscreen ........................................................... 5.4-1
5.4.2
TSC-2 ..................................................................... 5.4-2
5.5 Stop a running process recipe ............................................... 5.5-1
5.5.1
Touchscreen ........................................................... 5.5-1
5.5.2
TSC-2 ..................................................................... 5.5-2
5.6 Abort a running process recipe .............................................. 5.6-1
5.6.1
Touchscreen ........................................................... 5.6-1
5.6.2
TSC-2 ..................................................................... 5.6-2
5.7 Edit ‘Variable Process Command’.......................................... 5.7-1
5.7.1
Touchscreen ........................................................... 5.7-1
5.7.2
TSC-2 ..................................................................... 5.7-3