PROCESS SETUP AND ACCEPTANCE
P
ROCESS
M
ANUAL
3.2-2
TS860x 18
2.7
103
5.8
7.4
TS880x 20
2.7
115
6.4
8.2
TS8110x 25 2.7
143
8.0
10.2
TS1280x 20 4
251
14.1
18.0
3.2.3.2 LPCVD process
- due to the low pressure refresh intervals are not an issue. Use the initial gasflows and pressure
settings recommended in the appropriate process description.
- use a flat temperature
Most LPCVD processes exhibit the depletion effect.
This shows as a reduction in the deposition rate at the
pump side due to consumption of process gases
.
The reason to start of with a flat temperature is to make sure the machine is performing as
expected (and therefore
should
give a depletion effect). A ramped temperature can be used after that
to counter the expected depletion effects.
3.2.4
Further fine-tuning
Use the trouble shooting tables at each process desciption to fine-tune the process result, meet the
specifications and/or improve the process.
