Air-Vac PCBRM15, User Manual

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Pcbrm15 & PCBRM System 5.2 User’s Manual Chapter 5: Maintenance/Parts
Part No. 4005.00.906
5-16
For double-sided boards, solder flow is directed
away from adjacent bottom-side components.
For edge connectors, solder flows away
from the board.
(B)
(A)
The solder flow can be directed inward,
Protecting components near the lead pattern and
limiting heat to adjacent area or components.
The solder flow can be directed to large
select areas for multiple soldering of
components.
5.9 Tooling
5.9.1 Special Soldering/Desoldering Applications
•
Special Flow Wells and Cleaning Hoods can be manufactured for specific applications where
issues of clearance, adjacent components and mixed technology boards are concerns.
•
Consult Air-Vac for details concerning your specific requirements and the optimum solution.
•
A detailed dimensioned customer print and sample of the assembly are critical to design.
Flow Wells determine the size, shape and direction of the solder wave:
•
Bottom side critical areas must be addressed. Edge distances (A) and height of bottom side
components (B) must be known.