Air-Vac PCBRM15, User Manual

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PCBRM15 & PCBRM System 5.2 User’s Manual Chapter 4: Processes & Applications
Part No. 4005.00.906
4-22
Y-Axis Lock
Preheater
Z-Axis Lock
Board Lock
X-Axis
Carrier Lock
Z-Axis
Adjustment Wheel
X-Axis Lock
(preheater)
Board Temperature
Display
X-Axis Lock
(solder pot)
Mode Switch
(manual)
4.13 PCBRM System 5.2 - Soldering Sequence: Using Manual Mode for
Soldering
Note
S
ET
S
OLDER
C
YCLE
D
URATION
C
ONTROL TO MAXIMUM SETTING
. F
LOW MUST BE
DETERMINED PRIOR TO THESE STEPS
.
1. Install flow well.
2. Load board into carrier. If y-axis lock is used, position board to edge and tighten. Tighten board locks.
3. Slide board into preheater using the carrier handle until the x-axis lock (preheater) is reached. Adjust
z-axis adjustment when necessary. Be sure carrier is in the top position to avoid hitting flow well.
Carrier may be lowered to enhance preheating. Allow board to preheat to desired topside
temperature. IR sensor will monitor and display board temperature.
4. When board has reached desired temperature (alarm will occur) press footswitch to activate solder
flow. Skim off dross, if necessary.
5. Slide board over solder wave, using the carrier handle—until carrier hits x-axis lock. Turn carrier lock
to set.
6. Turn Z-Axis Adjustment Wheel until carrier hits z-axis lock (System 5.2 only).
7. Allow sufficient time for reflow.
8. Slowly turn Z-Axis Adjustment Wheel moving board upward to allow solder to slowly peel from the
component leads to alleviate bridging.
9. Turn off solder flow by pressing right side of footswitch.
10. Turn Z-Axis Adjustment Wheel to top position. Loosen Carrier Lock. Slide board away from solder
pot using the carrier handle. Remove board.
11. Repeat process.
Process Notes: