Air-Vac PCBRM15, User Manual

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PCBRM15 & PCBRM System 5.2 User’s Manual Chapter 4: Processes & Applications
Part No. 4005.00.906
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It may be desired to turn on solder flow while board is in the preheat position to allow flow well to
heat soak and dross to be skimmed prior to soldering.
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Reduce bridging by adjusting Ramp Down Flow Rate to zero (0). Or, manually raise board slowly
with Z-Axis Adjustment Wheel while solder is still flowing.
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Flux entire lead area. It may be required to flux topside of board. Allow sufficient temperature to a
be achieved to activate flux.
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Board must be level to solder wave. Fixturing may be required.
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The vertical position of the board is critical for proper soldering results. Allow solder to contact all
leads, but sufficient clearance for solder to flow. Bridging may be reduced by raising carrier position
and allowing solder to wick up the leads.
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Using tacky flux may allow more flux to remain during reflow, reducing bridging.
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Increasing preheat may be required for thermal challenging and lead free assemblies.
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It may be desired to lower the process temperature and increase process time if the board is prone
to delamination and/or discoloring.