Air-Vac PCBRM15, User Manual

Page: 66 / 120

PCBRM15 & PCBRM System 5.2 User’s Manual Chapter 4: Processes & Applications
Part No. 4005.00.906
4-24
4.14 Removal Procedure
4.14.1 Set Up
•
Set Ramp Down Flow Rate to 10.
•
Set Air Regulator to 5-7 psi.
•
Follow same procedure for automatic soldering procedure. If manual soldering procedure is used,
the operator must press the footswitch to stop the solder pumping and activate the hole cleaning
system.
4.14.2 Operation
Use automatic or manual procedure as described in soldering section up the when solder is contacting
the board.
Allow sufficient time for solder to contact component leads for easy removal.
Observe component leads and when all leads are molten, lift the component from the board using an
extractor tool that firmly grasps the component body. If solder is still flowing, interrupt cycle by pressing
the right side of the footswitch. Component should lift out easily.
The hole cleaning operation starts immediately at the end of the component removal procedure. There
will be an audible signal that indicates solder has stopped flowing against the board. At this time, lower
the Air Cleaning Hood. It is important that sufficient downward pressure be applied to insure a good
seal between the hood and board surface. Be sure entire area is sealed. Air leakage will prevent
maximum effectiveness of system. Hold is place during the entire time the air is applied.
Low pressure air comes on automatically 1 ½ seconds after the solder stops flowing, forcing the
molten solder to drop from the holes into the empty flow well. The 1 ½ seconds delay prevents
pressurized air from coming in contact with the flowing solder.
The bottom of the board may have bridging or icicling caused by the moving air. The next operation of
resoldering of the replacement component will eliminate these conditions.
Depending upon the heat sink characteristics of the board, the number of leads, and shape of the lead
pattern, there will be some holes that will not be completely clear of solder.