
Parameter
Value
PM59x: 90 mA
PM59x-ETH: 150 mA
PM59x-2ETH: 150 mA
PM59x-ARCNET: 150 mA
Fuse melting integral at 24 VDC
Min. 1 A
²
s
1
)
see
Chapter 2.4.5.2 “Dimensioning of the
Max. input power from 24 VDC
10 W
2
)
Slots on the terminal bases
TB511: 1 processor module, 1 communication
module
TB521 / TB523: 1 processor module, 2 communi-
cation modules
TB541: 1 processor module, 4 communication
modules
Processor module interfaces at the ter-
minal bases TB5x1
I/O bus, COM1, COM2, FBP
Processor module interfaces at the ter-
minal bases TB5x3
I/O bus, COM1
Processor module network interfaces at
the terminal bases
TB5x1-ETH
TB5x3-ETH
/ PM5xx-ARCNET: ARCNET
Connection system
see System Assembly, Construction and Connec-
tion
Chapter 2.6.4 “Connection and Wiring”
Weight (processor module without ter-
minal base)
PM582: 135 g
PM58x-ETH: 150 g
PM59x: 135 g
PM59x-ETH: 150 g
PM59x-2ETH: 150 g
PM59x-ARCNET: 160 g
Mounting position
Horizontal or vertical
Table 9: Remarks:
1
)
The inrush current and the melting integral of the processor module depends on
the processor module's integrated power supply, and the number and type of
communication modules and I/O modules connected to the I/O bus. The values
are valid for all processor modules.
2
)
Including communication modules and I/O bus modules
Device Specifications
Processor Modules > AC500 (Standard)
2019/04/17
3ADR010121, 13, en_US
71