SMART Embedded Computing COMX-CORE-2610-ET, Инструкция по установке и эксплуатации

Страница: 55 / 92

Chipset
COMX-CORE-2610-ET Installation and Use (6806800P11E) 55
 Support Digital Thermal Sensor, Intel Adaptive Thermal Monitor
 Manufactured on 32nm process
 TDP include 17W, 25W, 35W and 45W
 Package: A 31 x 24mm BGA package (BGA1023)
4.4 Chipset
The COMX-CORE-2610-ET supports Intel Mobile QM67 chipset. The features of the
chipset are:
 Supports up to eight x1 PCI Express interfaces
 Supports up to two SATA 6G and four SATA 3G
 Supports up to 14 USB 2.0
 Provides a LPC interface for TPM, FWH etc.
 Provides a SM bus, it is I2C compatible
 Provides two chip select of SPI
 SPI frequency is 20MHz or 33MHz
 Provides a HD audio interface
 Supports VGA + LVDS display interface
 Supports three digital display interfaces
4.5 I2C Serial Interface and Device
There is an SM bus controller on QM67 PCH, which is I2C compatible. Following are the
devices that connect to SM bus.
 2KB serial EEPROM for vendor information
 The SPD of two DDR3 SODIMM
 Embedded controller NCT7802Y
 LAN Intel82579LM
 I2C interface routing to connector for devices on carrier board through PCA9515