Lenovo ThinkServer n400, Инструкция по установке и обслуживанию

Страница: 142 / 206

• Be extremely careful, the microprocessor socket contacts are very fragile. Do not touch the
microprocessor socket contacts. Contaminants on the microprocessor contacts or microprocessor socket
contacts, such as oil from your skin, can cause connection failures between the contacts and the socket.
• Do not allow the thermal grease on the microprocessor and heat sink to come in contact with anything.
Contact with any surface can contaminate the thermal grease and the microprocessor socket.
• Do not use any tools or sharp objects to lift the locking levers on the microprocessor socket. Doing so
might result in permanent damage to the system board.
• Each microprocessor socket must always contain either a socket cover or a microprocessor and heat sink.
• Be sure to use only the installation tools provided with the new microprocessor to remove or install
the microprocessor. Do not use any other tool.
• When installing multiple microprocessors, open one microprocessor socket at a time to avoid damaging
other microprocessor socket contacts.
• The microprocessor installation tool has the microprocessor installed on the tool, and may have a
protective cover over the microprocessor. Do not use the tool, or remove the cover until you are
instructed to do so.
Note: Be sure to use the installation tool that comes with your microprocessor installation tool assembly.
The tool has two settings for installing two different sizes of microprocessors. The settings that are marked
on the tool are “L” for smaller low core microprocessors, and “H” for larger high core microprocessors.
Figure 65. Microprocessor installation tool
To remove a microprocessor and heat sink, complete the following steps:
Step 1. Read the safety information that begins on “Safety” on page v and “Installation guidelines”
on page 75.
Step 2. Turn off the server and peripheral devices.
Step 3. Remove the compute node (see “Removing a compute node from a chassis” on page 77).
Step 4. Remove the air baffle (see “Removing the air baffle” on page 86).
Step 5. Remove the two DIMMs located next to the heat sink (see “Removing a DIMM” on page 93).
Step 6. Locate the microprocessor to be removed (see “System-board internal connectors” on page 23).
Step 7. Remove the heat sink.
Attention: Do not touch the thermal material on the bottom of the heat sink. Touching the thermal
material will contaminate it. If the thermal material on the microprocessor or heat sink becomes
contaminated, you must wipe off the contaminated thermal material on the microprocessor or heat
sink with the alcohol wipes and reapply clean thermal grease to the heat sink.
126
Lenovo ThinkServer sd350 Server Type 5493, Lenovo ThinkServer n400 Enclosure Type 5495Installation and Service Guide