Thermal/Mechanical Design Guide
91
Embedded Thermal Solutions
E
Embedded Thermal Solutions
This section describes the LV processors and Embedded reference heatsinks for NEBS
(Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications
Computing Architecture) systems. These LV processors are good for any form factor
that needs to meet NEBS requirements.
E.1
Performance Targets
Table E-1
and
Table E-2
provide boundary conditions and performance targets for 1U
and ATCA heatsinks. These values are used to generate processor thermal
specifications and to provide guidance for heatsink design.
NOTES:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (
Section 5.5.1
).
3. Reference system configuration. In a single wide ATCA blade the 60 W processor should be used in single
Table E-1.
Boundary Conditions and Performance Targets for Intel® Xeon® Processor
5500 Series
Parameter
Value
Value
Altitude, system ambient temp
Nominal/Short-term
Sea level, 40
o
C/55C
Sea level, 40
o
C/55C
TDP
60 W
38 W
T
LA
1,4
51.9/66.9
o
C
50/65
o
C
CA
2
0.336
o
C/W
0.532
o
C/W
System height (form factor)
3
1U (EEB) or ATCA
ATCA
Heatsink volumetric
1U (90 x 90 x 27) or Custom
ATCA (90 x 90 x 13mm + heat
exchanger)
ATCA (90 x 90 x 13 mm)
Heatsink technology
5
Cu base, Cu fins
Table E-2.
Boundary Conditions and Performance Targets for Intel® Xeon® Processor
5600 Series
Parameter
Value
Value
Altitude, system ambient temp
Nominal/Short-term
Sea level, 40
o
C/55C
Sea level, 40
o
C/55C
TDP
60 W
40W
T
LA
1,4
51.7/66.7
o
C
50/65
o
C
CA
2
0.306
o
C/W
0.548
o
C/W
System height (form factor)
3
1U (EEB) or ATCA
ATCA
Heatsink volumetric
1U (90 x 90 x 27) or Custom
ATCA (90 x 90 x 13mm + heat
exchanger)
ATCA (90 x 90 x 13 mm)
Heatsink technology
5
Cu base, Cu fins
Содержание X5550 - Quad Core Xeon
Страница 8: ...8 Thermal Mechanical Design Guide ...
Страница 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Страница 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Страница 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Страница 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Страница 50: ...Mechanical Drawings 50 Thermal Mechanical Design Guide Figure B 1 Board Keepin Keepout Zones Sheet 1 of 4 ...
Страница 51: ...Thermal Mechanical Design Guide 51 Mechanical Drawings Figure B 2 Board Keepin Keepout Zones Sheet 2 of 4 ...
Страница 52: ...Mechanical Drawings 52 Thermal Mechanical Design Guide Figure B 3 Board Keepin Keepout Zones Sheet 3 of 4 ...
Страница 53: ...Thermal Mechanical Design Guide 53 Mechanical Drawings Figure B 4 Board Keepin Keepout Zones Sheet 4 of 4 ...
Страница 54: ...Mechanical Drawings 54 Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...
Страница 55: ...Thermal Mechanical Design Guide 55 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...
Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 9 Heatsink Shoulder Screw 1U 2U and Tower ...
Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...
Страница 60: ...Mechanical Drawings 60 Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...
Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...
Страница 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Страница 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
Страница 95: ...Thermal Mechanical Design Guide 95 Embedded Thermal Solutions Figure E 5 UP ATCA Heat Sink Drawing ...
Страница 102: ...Processor Installation Tool 102 Thermal Mechanical Design Guide Figure F 1 Processor Installation Tool ...
