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LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Thermal/Mechanical Design Guide

A detailed description of this methodology can be found at:

ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.

Figure 4-1.

Flow Chart of Knowledge-Based Reliability Evaluation Methodology

Establish the
market/expected use
environment for the
technology

Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search

Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors

Freeze stressing
requirements and perform
additional data turns

Содержание X5550 - Quad Core Xeon

Страница 1: ...Reference Number 321323 002 Intel Xeon Processor 5500 5600 Series Thermal Mechanical Design Guide March 2010 ...

Страница 2: ...ata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Intel processor numbers are not a measure of performance Processor numbers differentiate features within each processor family not across dif...

Страница 3: ... and Environmental Specifications 27 4 1 Component Mass 27 4 2 Package Socket Stackup Height 27 4 3 Socket Maximum Temperature 27 4 4 Loading Specifications 28 4 5 Electrical Requirements 28 4 6 Environmental Requirements 29 5 Thermal Solutions 31 5 1 Performance Targets 31 5 1 1 25 5 mm Tall Heatsink 32 5 2 Heat Pipe Considerations 33 5 3 Assembly 34 5 3 1 Thermal Interface Material TIM 35 5 4 St...

Страница 4: ...ick and Place Cover Removed 13 2 2 LGA1366 Socket Contact Numbering Top View of Socket 14 2 3 LGA1366 Socket Land Pattern Top View of Board 15 2 4 Attachment to Motherboard 16 2 5 Pick and Place Cover 17 2 6 Package Installation Removal Features 18 2 7 LGA1366 NCTF Solder Joints 20 3 1 ILM Cover Assembly 22 3 2 Back Plate 23 3 3 ILM Assembly 24 3 4 Pin1 and ILM Lever 25 4 1 Flow Chart of Knowledge...

Страница 5: ...er Reference Heatsink Assembly with TIM Sheet 1 of 2 74 B 26 Tower Reference Heatsink Assembly with TIM Sheet 2 of 2 75 B 27 25 5mm Reference Heatsink Assembly Sheet 1 of 2 76 B 28 25 5mm Reference Heatsink Assembly Sheet 2 of 2 77 B 29 25 5mm Reference Heatsink Fin and Base Sheet 1 of 2 78 B 30 25 5mm Reference Heatsink Fin and Base Sheet 2 of 2 79 B 31 25 5mm Reference Heatsink Assembly with TIM...

Страница 6: ...or 5500 Series with 25 5 mm Tall Heatsink 32 5 4 Fan Speed Control TCONTROL and DTS Relationship 37 5 5 TCONTROL Guidance 38 6 1 Heatsink Test Conditions and Qualification Criteria 41 A 1 Suppliers for the Intel Reference Thermal Solution 45 A 2 Suppliers for the Intel Collaboration Thermal Solution 46 A 3 Suppliers for the Alternative Thermal Solution 46 A 4 LGA1366 Socket and ILM Components 47 B...

Страница 7: ...e and updated the force associated with it Table 5 1 Changed dP for 2U and Tower heatsink Table 5 2 Added Boundary Conditions and Performance Targets for Intel Xeon Processor 5600 Series Figure 5 1 replaced curves for 1U with equations for 1U 2U and Tower Table 5 3 specified for Intel Xeon Processor 5500 Series Processors Table 5 3 updated PSIca and dP values Figure 5 3 replaced to show ILM load p...

Страница 8: ...8 Thermal Mechanical Design Guide ...

Страница 9: ...ociated retention hardware The LGA1366 socket and the Independent Loading Mechanism ILM and back plate Processors in 1 socket Workstation platforms are covered in the Intel Core i7 900 Desktop Processor Extreme Edition Series and Intel Core i7 900 Desktop Processor Series Intel Xeon Processor 3500 Series and LGA1366 Socket Thermal Mechanical Design Guide The goals of this document are To assist bo...

Страница 10: ...mperature FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1366 LGA land package onto the socket contacts LGA1366 socket The processor mates with the system b...

Страница 11: ...ximum operating temperature Thermal Profile Line that defines case temperature specification of a processor at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the heatsink TLA The measured ambient temperature lo...

Страница 12: ...Introduction 12 Thermal Mechanical Design Guide ...

Страница 13: ...unting on the motherboard The socket has 1366 contacts with 1 016 mm X 1 016 mm pitch X by Y in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent Loading Mechanism ILM The design includes a back plate which is integral to having a uniform load on the socket sol...

Страница 14: ...LGA1366 Socket 14 Thermal Mechanical Design Guide Figure 2 2 LGA1366 Socket Contact Numbering Top View of Socket ...

Страница 15: ...6 Socket Land Pattern Top View of Board A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 16 12 15 13 14 17 18 24 20 19 23 21 22 25 26 32 28 27 31 29 30 33 34 40 36 35 39 37...

Страница 16: ...ivalent with UL 94 V 0 flame rating capable of withstanding 260 C for 40 seconds typical reflow rework The socket coefficient of thermal expansion in the XY plane and creep properties must be such that the integrity of the socket is maintained for the conditions listed in the LGA1366 Socket Validation Reports The color of the housing will be dark as compared to the solder balls to provide the cont...

Страница 17: ...ing reflow to help prevent contamination during reflow The cover can withstand 260 C for 40 seconds typical reflow rework profile and the conditions listed in the LGA1366 Socket Validation Reports without degrading As indicated in Figure 2 5 the cover remains on the socket during ILM installation and should remain on whenever possible to help prevent damage to the socket contacts Cover retention m...

Страница 18: ...rough alignment of package to socket The socket has alignment walls at the four corners to provide final alignment of the package See Appendix F for information regarding a tool designed to provide mechanical assistance during processor installation and removal 2 4 1 Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after sold...

Страница 19: ...for 40 seconds typical reflow rework profile without degrading and must be visible after the socket is mounted on the motherboard LGA1366 and the manufacturer s insignia are molded or laser marked on the side wall 2 7 Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Ta...

Страница 20: ...y Figure 2 7 identifies the NCTF solder joints Note For platforms supporting the DP processor land C3 is CTF Figure 2 7 LGA1366 NCTF Solder Joints A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 2 8 4 6 10 16 12 14 ...

Страница 21: ...iled studies and may not incorporate critical design parameters 3 1 Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover assembly and back plate 3 1 1 ILM Cover Assembly Design Overview The ILM Cover assembly consists of four major pieces load lever load plate frame and the captive fasteners The load lever and ...

Страница 22: ... the motherboard for proper assembly of the ILM around the socket A clearance hole is located at the center of the plate to allow access to test points and backside capacitors An additional cut out on two sides provides clearance for backside voltage regulator components An insulator is pre applied Back plates for processors in 1 socket Workstation platforms are covered in the Intel Core i7 900 De...

Страница 23: ...back plate is placed in a fixture Holes in the motherboard provide alignment to the threaded studs In step 2 the ILM cover assembly is placed over the socket and threaded studs Using a T20 Torx driver fasten the ILM cover assembly to the back plate with the four captive fasteners Torque to 9 1 inch pounds The length of the threaded studs accommodate board thicknesses from 0 062 to 0 100 Figure 3 2...

Страница 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...

Страница 25: ...echanism ILM As indicated in Figure 3 4 socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to the socket The result is a specific Pin 1 orientation with respect to the ILM lever Figure 3 4 Pin1 and ILM Lever ...

Страница 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...

Страница 27: ...e IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor EMTS 2 This value is a RSS calculation 4 3 Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance To ensure socket long term reliability Intel defines socket maximum temperature using a via on the under...

Страница 28: ...seat the processor onto the socket contacts 5 Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 550 gm 1 21 lb with 50 g acceleration measured at heatsink mass The dynamic portion of this specification in the product application can have flexibility in specific values but the ultimate product of mass ti...

Страница 29: ...inductance L NA The inductance on a contact due to any single neighboring contact Maximum mutual capacitance C 1 pF The capacitance between two contacts Socket Average Contact Resistance EOL 15 2 m The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing with a chain contact resistance defined as the resistance of each cha...

Страница 30: ... reliability pdf Figure 4 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the market expected use environment for the technology Develop Speculative stress conditions based on historical data content experts and literature search Perform stressing to validate accelerated stressing assumptions and determine acceleration factors Freeze stressing requirements and perform ...

Страница 31: ...e A 130W WS9 TLA 1 49oC 49oC 49oC 55oC 40oC CA 2 0 335o C W 0 336o C W 0 337o C W 0 201o C W 0 201o C W Airflow3 9 7 CFM 0 20 dP 9 7 CFM 0 20 dP 9 7 CFM 0 20 dP 30 CFM 0 173 dP 30 CFM 0 173 dP System height form factor 4 1U EEB 1U EEB 1U EEB 5 2U EEB Pedestal EEB Heatsink volumetric 90 x 90 x 27mm 1U 6 90 x 90 x 64mm 2U 6 7 90 x 90 x 99mm Tower 6 Heatsink technology8 Cu base Al fins Cu Al base Al ...

Страница 32: ...ressure drop targets for other airflows use Best fit equations in Figure 5 1 Heatsink detailed drawings are in Appendix B 5 1 1 25 5 mm Tall Heatsink For the 25 5 mm tall heatsink Table 5 3 provides guidance regarding performance expectations These values are not used to generate processor thermal specifications Notes 1 Local ambient temperature of the air entering the heatsink 2 Max target mean 3...

Страница 33: ...ds http ssiforum org 6 Passive heatsinks Dow Corning TC 1996 thermal interface material 5 2 Heat Pipe Considerations Figure 5 2 shows the orientation and position of the TTV die The TTV die is sized and positioned similarly to the processor die Figure 5 2 TTV Die Size and Orientation Figure 1 Side Views of Package with IHS not to scale Cache Cache Cache Cache Core Cache 45 19 3 1 0 Package CL Die ...

Страница 34: ...ve screws to 8 inch pounds Fastener sequencing starting threads on all four screws before torquing may mitigate against cross threading This assembly process is designed to produce a static load of 39 51 lbf for 0 062 0 100 board thickness respectively Honeywell PCM45F is expected to meet the performance targets in Table 5 1 from 30 60 lbf From Table 4 3 the Heatsink Static Compressive Load of 0 6...

Страница 35: ...on during shock Placement of board to chassis mounting holes also impacts board deflection and resultant socket solder ball stress Customers need to assess shock for their designs as their heatsink retention back plate heatsink mass and chassis mounting holes may vary 5 5 Thermal Design 5 5 1 Thermal Characterization Parameter The case to local ambient Thermal Characterization Parameter CA is defi...

Страница 36: ...CC activation risk For heatsinks that comply to Profile B yet do not comply to Profile A 1U heatsink in Figure 5 5 the processor has an increased probability of TCC activation and an associated measurable performance loss Measurable performance loss is defined to be any degradation in processor performance greater than 1 5 1 5 is chosen as the baseline since run to run variation in a performance b...

Страница 37: ... processor local ambient temperature is above the y axis intercept for Profile A 5 6 Thermal Features More information regarding processor thermal features is contained in the appropriate datasheet 5 6 1 Fan Speed Control There are many ways to implement fan speed control Using processor ambient temperature in addition to Digital Thermal Sensor to scale fan speed can improve acoustics when DTS TCO...

Страница 38: ...lementation of TCONTROL of 1 may increase risk of throttling Thermal Control Circuit activation Increased TCC activation may or may not result in measurable performance loss Thermal Profile still applies If PECI TCONTROL Guidance then the case temperature must meet the Thermal Profile 5 6 2 PECI Averaging and Catastrophic Thermal Management By averaging DTS over PECI thermal solution failure can b...

Страница 39: ...T is disabled This may result in higher acoustics With Intel TBT enabled processors with dual thermal profiles described in Section 5 5 2 have greater potential for performance delta between Profile A and Profile B platforms as compared to previous platforms 5 7 Thermal Guidance 5 7 1 Thermal Excursion Power for Processors with Dual Thermal Profile Under fan failure or other anomalous thermal excu...

Страница 40: ...mage to the processor Thermal Test Vehicle TTV may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value as measured on the TTV does not exceed Tcase_max at the anomalous power level for the environmental condition of interest This anomalous power level is equal to 75 of the TDP limit This guidance can be applied to 80 W Intel Xeon processor 5500 series...

Страница 41: ...able 5 2 Pressure drop not to exceed value in Table 5 1 and Table 5 2 15 3 Board Level UnPackaged Vibration 5 Hz 0 01 g2 Hz to 20 Hz 0 02 g2 Hz slope up 20 Hz to 500 Hz 0 02 g2 Hz flat Input acceleration is 3 13 g RMS 10 minutes axis for all 3 axes on all samples Random control limit tolerance is 3 dB No damage to heatsink base or pipe No visual defects As verified in wind tunnel Mean CA 2 54s off...

Страница 42: ...lue for 95W in 1U 2 5 mean CA 3s offset not to exceed Table 5 2 value for 2U Thermal Test data re assessed from Intel Xeon Processor 5500 Series Qualification 9 Thermal Cycling Required for heatpipe designs Temperature range at pipe in heatsink assembly 25C to 100C for 500 cycles Cycle time is 30 minutes per full cycle divided into half cycle in hot zone and half in cold zone with minimum 1min soa...

Страница 43: ...ir use conditions Intel reference components are also used in board functional tests to assess performance for specific conditions 6 2 1 Board Functional Test Sequence Each test sequence should start with components baseboard heatsink assembly and so on that have not been previously submitted to any reliability testing The test sequence should always start with a visual inspection after assembly a...

Страница 44: ...ts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 6 3 Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials suc...

Страница 45: ...rence thermal solutions from the suppliers listed in Table A 1 A 1 2 Intel Collaboration Thermal Solution The Intel collaboration thermal solutions have been verified to meet the criteria outlined in Table 6 1 Customers can purchase the Intel collaboration thermal solutions from the suppliers listed in Table A 2 Table A 1 Suppliers for the Intel Reference Thermal Solution Assembly Component Descri...

Страница 46: ...tel specified retention includes TIM 130W capable Chaun Choung Technology Corp CCI pn 0007029401 Chaun Choung Technology Corp CCI Monica Chih monica_chih ccic com tw 886 2 2995 2666 x1131 Harry Lin hlinack aol com 714 739 5797 Table A 3 Suppliers for the Alternative Thermal Solution Sheet 1 of 2 Assembly Component Description Supplier PN Intel Xeon Processor 5500 Series Intel Xeon Processor 5600 S...

Страница 47: ... PJMHS 07 GP www CoolerMaster com 95W capable 80W capable Standard TaiSol Corporation 1A0 9041000960 A www Taisol com 95W capable 130W capable Low Cost Dynatron Corporation Top Motor Dynaeon G520 www Dynatron Corp com 80W capable 80W capable Low Cost CoolJag JAC0B40A www CoolJag com 80W capable 80W capable Assembly Heatsink Tower Tower Alternative URS Heatsink Standard TaiSol Corporation 1A0 90510...

Страница 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...

Страница 49: ... Sheet 1 of 2 Figure B 15 2U Collaborative Heatsink Volumetric Sheet 2 of 2 Figure B 16 Tower Collaborative Heatsink Assembly Sheet 1 of 2 Figure B 17 Tower Collaborative Heatsink Assembly Sheet 2 of 2 Figure B 18 Tower Collaborative Heatsink Volumetric Sheet 1 of 2 Figure B 19 Tower Collaborative Heatsink Volumetric Sheet 2 of 2 Figure B 20 1U Reference Heatsink Assembly with TIM Sheet 1 of 2 Fig...

Страница 50: ...Mechanical Drawings 50 Thermal Mechanical Design Guide Figure B 1 Board Keepin Keepout Zones Sheet 1 of 4 ...

Страница 51: ...Thermal Mechanical Design Guide 51 Mechanical Drawings Figure B 2 Board Keepin Keepout Zones Sheet 2 of 4 ...

Страница 52: ...Mechanical Drawings 52 Thermal Mechanical Design Guide Figure B 3 Board Keepin Keepout Zones Sheet 3 of 4 ...

Страница 53: ...Thermal Mechanical Design Guide 53 Mechanical Drawings Figure B 4 Board Keepin Keepout Zones Sheet 4 of 4 ...

Страница 54: ...Mechanical Drawings 54 Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...

Страница 55: ...Thermal Mechanical Design Guide 55 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...

Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 7 1U Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 8 1U Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 9 Heatsink Shoulder Screw 1U 2U and Tower ...

Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...

Страница 60: ...Mechanical Drawings 60 Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...

Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...

Страница 62: ...Mechanical Drawings 62 Thermal Mechanical Design Guide Figure B 13 2U Collaborative Heatsink Assembly Sheet 1 of 2 ...

Страница 63: ...Thermal Mechanical Design Guide 63 Mechanical Drawings Figure B 14 2U Collaborative Heatsink Assembly Sheet 2 of 2 ...

Страница 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide Figure B 15 2U Collaborative Heatsink Volumetric Sheet 1 of 2 ...

Страница 65: ...Thermal Mechanical Design Guide 65 Mechanical Drawings Figure B 16 2U Collaborative Heatsink Volumetric Sheet 2 of 2 ...

Страница 66: ...Mechanical Drawings 66 Thermal Mechanical Design Guide Figure B 17 Tower Collaborative Heatsink Assembly Sheet 1 of 2 ...

Страница 67: ...Thermal Mechanical Design Guide 67 Mechanical Drawings Figure B 18 Tower Collaborative Heatsink Assembly Sheet 2 of 2 ...

Страница 68: ...Mechanical Drawings 68 Thermal Mechanical Design Guide Figure B 19 Tower Collaborative Heatsink Volumetric Sheet 1 of 2 ...

Страница 69: ...Thermal Mechanical Design Guide 69 Mechanical Drawings Figure B 20 Tower Collaborative Heatsink Volumetric Sheet 2 of 2 ...

Страница 70: ...Mechanical Drawings 70 Thermal Mechanical Design Guide Figure B 21 1U Reference Heatsink Assembly with TIM Sheet 1 of 2 ...

Страница 71: ...Thermal Mechanical Design Guide 71 Mechanical Drawings Figure B 22 1U Reference Heatsink Assembly with TIM Sheet 2 of 2 ...

Страница 72: ...Mechanical Drawings 72 Thermal Mechanical Design Guide Figure B 23 2U Reference Heatsink Assembly with TIM Sheet 1 of 2 ...

Страница 73: ...Thermal Mechanical Design Guide 73 Mechanical Drawings Figure B 24 2U Reference Heatsink Assembly with TIM Sheet 2 of 2 ...

Страница 74: ...Mechanical Drawings 74 Thermal Mechanical Design Guide Figure B 25 Tower Reference Heatsink Assembly with TIM Sheet 1 of 2 ...

Страница 75: ...Thermal Mechanical Design Guide 75 Mechanical Drawings Figure B 26 Tower Reference Heatsink Assembly with TIM Sheet 2 of 2 ...

Страница 76: ...Mechanical Drawings 76 Thermal Mechanical Design Guide Figure B 27 25 5mm Reference Heatsink Assembly Sheet 1 of 2 ...

Страница 77: ...Thermal Mechanical Design Guide 77 Mechanical Drawings Figure B 28 25 5mm Reference Heatsink Assembly Sheet 2 of 2 ...

Страница 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide Figure B 29 25 5mm Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 79: ...Thermal Mechanical Design Guide 79 Mechanical Drawings Figure B 30 25 5mm Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 80: ...Mechanical Drawings 80 Thermal Mechanical Design Guide Figure B 31 25 5mm Reference Heatsink Assembly with TIM Sheet 1 of 2 ...

Страница 81: ...Thermal Mechanical Design Guide 81 Mechanical Drawings Figure B 32 25 5mm Reference Heatsink Assembly with TIM Sheet 2 of 2 ...

Страница 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...

Страница 83: ...mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of 4 Figure C 2 Socket Mechanical Drawing Sheet 3 of 4 Figure C 3 Socket Mechanical Drawing Sheet 4 of 4 Figure C 4 ...

Страница 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide Figure C 1 Socket Mechanical Drawing Sheet 1 of 4 ...

Страница 85: ...Thermal Mechanical Design Guide 85 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4 ...

Страница 86: ...Socket Mechanical Drawings 86 Thermal Mechanical Design Guide Figure C 3 Socket Mechanical Drawing Sheet 3 of 4 ...

Страница 87: ...Thermal Mechanical Design Guide 87 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4 ...

Страница 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...

Страница 89: ...d to meet the performance targets for Thermal Interface Material in Table 5 3 the Heatsink Static Compressive Load can be assessed using the items listed below HP34970A DAQ Omegadyne load cell 100 lbf max LCKD 100 Test board 0 062 with ILM back plate installed 8 in lbf pneumatic driver Heatsink Intel Xeon processor 5500 series Load Cell Fixture Figure D 1 ...

Страница 90: ...Heatsink Load Metrology 90 Thermal Mechanical Design Guide Figure D 1 Intel Xeon Processor 5500 Series Load Cell Fixture ...

Страница 91: ...on In a single wide ATCA blade the 60 W processor should be used in single Table E 1 Boundary Conditions and Performance Targets for Intel Xeon Processor 5500 Series Parameter Value Value Altitude system ambient temp Nominal Short term Sea level 40o C 55C Sea level 40o C 55C TDP 60 W 38 W TLA 1 4 51 9 66 9o C 50 65o C CA 2 0 336o C W 0 532o C W System height form factor 3 1U EEB or ATCA ATCA Heats...

Страница 92: ...with reading the graph Other LGA1366 compatible thermal solutions may work with the same retention E 2 Thermal Design Guidelines E 2 1 NEBS Thermal Profile Processors that offer a NEBS compliant thermal profile are specified in the appropriate Datasheet NEBS thermal profiles help relieve thermal constraints for Short Term NEBS conditions To help reliability processors must meet the nominal thermal...

Страница 93: ...nd UP ATCA configurations with custom thermal solutions In order to cool this part in a single wide ATCA slot a custom thermal solution will be required Since solutions like this will be very configuration specific this heat sink was not fully designed with retention and keep out definitions In order to cool the additional power of a 60W processor in ATCA the heat sink volume was increased The ass...

Страница 94: ...olutions 94 Thermal Mechanical Design Guide NOTES Thermal sample only retention not production ready NOTES Heat sink should be optimized for the layout Figure E 3 UP ATCA Thermal Solution Figure E 4 UP ATCA System Layout ...

Страница 95: ...Thermal Mechanical Design Guide 95 Embedded Thermal Solutions Figure E 5 UP ATCA Heat Sink Drawing ...

Страница 96: ...Component Suppliers Assembly Component Description Supplier PN Supplier Contact Info Assembly Heat Sink Nehalem EP ATCA ATCA Reference heatsink Intel P N E65918 001 ATCA Copper Fin Copper Base Fujikura HSA 7901 Fujikura America Ash Ooe a_ooe fujikura com 408 748 6991 Fujikura Taiwan Branch Yao Hsien Huang yeohsien fujikuratw com tw 886 2 8788 4959 Table E 4 Mechanical Drawings List Parameter Value...

Страница 97: ...Thermal Mechanical Design Guide 97 Embedded Thermal Solutions Figure E 6 ATCA Reference Heat Sink Assembly Sheet 1 of 2 ...

Страница 98: ...Embedded Thermal Solutions 98 Thermal Mechanical Design Guide Figure E 7 ATCA Reference Heat Sink Assembly Sheet 2 of 2 ...

Страница 99: ...Thermal Mechanical Design Guide 99 Embedded Thermal Solutions Figure E 8 ATCA Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 100: ...Embedded Thermal Solutions 100 Thermal Mechanical Design Guide Figure E 9 ATCA Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 101: ...Tool F Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal Contact the supplier for details regarding this tool Billy Hsieh billy hsieh tycoelectronics com 81 44 844 8292 ...

Страница 102: ...Processor Installation Tool 102 Thermal Mechanical Design Guide Figure F 1 Processor Installation Tool ...

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