Thermal/Mechanical Design Guide
17
LGA1366 Socket
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in
Appendix C
.
2.3.3
Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 m
[15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in the LGA1366 Socket Validation Reports without degrading.
As indicated in
Figure 2-5
, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in
Figure 2-5
, a Pin1 indicator on the cover provides a visual reference for proper
orientation with the socket.
See LGA1366_Socket_Pick_and_Place_Removal_Tool_rev2.0 for a drawing of a tool
designed to provide mechanical assistance during cover installation and removal.
Figure 2-5.
Pick and Place Cover
Содержание X5550 - Quad Core Xeon
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Страница 50: ...Mechanical Drawings 50 Thermal Mechanical Design Guide Figure B 1 Board Keepin Keepout Zones Sheet 1 of 4 ...
Страница 51: ...Thermal Mechanical Design Guide 51 Mechanical Drawings Figure B 2 Board Keepin Keepout Zones Sheet 2 of 4 ...
Страница 52: ...Mechanical Drawings 52 Thermal Mechanical Design Guide Figure B 3 Board Keepin Keepout Zones Sheet 3 of 4 ...
Страница 53: ...Thermal Mechanical Design Guide 53 Mechanical Drawings Figure B 4 Board Keepin Keepout Zones Sheet 4 of 4 ...
Страница 54: ...Mechanical Drawings 54 Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...
Страница 55: ...Thermal Mechanical Design Guide 55 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...
Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 9 Heatsink Shoulder Screw 1U 2U and Tower ...
Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...
Страница 60: ...Mechanical Drawings 60 Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...
Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...
Страница 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Страница 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
Страница 95: ...Thermal Mechanical Design Guide 95 Embedded Thermal Solutions Figure E 5 UP ATCA Heat Sink Drawing ...
Страница 102: ...Processor Installation Tool 102 Thermal Mechanical Design Guide Figure F 1 Processor Installation Tool ...
