Intel X5550 - Quad Core Xeon, Руководство по конструкции

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Thermal/Mechanical Design Guide 31
Thermal Solutions
5
Thermal Solutions
This section describes a 1U reference heatsink, design targets for 2U and Tower
heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design
guidelines for processors in the Intel® Xeon® 5500 Platform.
5.1 Performance Targets
Values for boundary conditions and performance targets are used to generate
processor thermal specifications and to provide guidance for heatsink design.
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (
Section 5.5.1 ).
Table 5-1. Boundary Conditions and Performance Targets for Intel® Xeon® Processor
5500 Series
Parameter Value
Altitude, system
ambient temp Sea level, 35
o
C
TDP 60W 80W 95W, Profile B 95W, Profile A 130W, WS
9
T
LA
1
49
o
C 49
o
C 49
o
C 55
o
C 40
o
C
CA
2
0.335
o
C/W 0.336
o
C/W 0.337
o
C/W 0.201
o
C/W 0.201
o
C/W
Airflow
3
9.7 CFM @
0.20” dP 9.7 CFM @
0.20” dP 9.7 CFM @
0.20” dP 30 CFM @
0.173” dP 30 CFM @
0.173” dP
System height
(form factor)
4
1U (EEB) 1U (EEB) 1U (EEB)
5
2U (EEB) Pedestal (EEB)
Heatsink
volumetric 90 x 90 x 27mm (1U)
6
90 x 90 x 64mm
(2U)
6,7
90 x 90 x 99mm
(Tower)
6
Heatsink
technology
8
Cu base, Al fins Cu/Al base, Al fins with heatpipes
Table 5-2. Boundary Conditions and Performance Targets for Intel Xeon processor 5600
series
Parameter Value
Altitude, system
ambient temp Sea level, 35
o
C
TDP 40W 60W 80W 95W, Profile B 95W, Profile A 130W
T
LA
1
49
o
C 55
o
C 53
o
C
CA
2
(6 core) n/a 0.340ºC/W 0.340ºC/W 0.340ºC/W 0.200ºC/W 0.196ºC/W
CA
2
(4 core) 0.353ºC/W n/a 0.357ºC/W 0.357
o
C/W 0.217
o
C/W 0.211
o
C/W
Airflow
3
9.7 CFM @ 0.20” dP 30 CFM @
0.173” dP 35 CFM @
0.214” dP
System height
(form factor)
4
1U (EEB) 2U (EEB)
Heatsink
volumetric 90 x 90 x 27mm (1U)
6
90 x 90 x 64mm (2U)
6,7
Heatsink
technology
8
Cu base, Al fins Cu/Al base, Al fins with
heatpipes