19 ELECTRICAL CHARACTERISTICS
S1C17M12/M13 TECHNICAL MANUAL
Seiko Epson Corporation
19-1
(Rev. 1.2)
19 Electrical Characteristics
19.1 Absolute Maximum Ratings
(V
SS
= V
SS2
= 0 V)
Item
Symbol
Condition
Rated value
Unit
Power supply voltage
V
DD
-0.3 to 7.0
V
V
DD2
P50–54
-0.3 to 7.0
V
Flash programming voltage
V
PP
-0.3 to 8.0
V
Input voltage
V
I
P00–07, P10–17, P20–24, P40–47, P50–54,
PD0–D1, PD3–D4
-0.3 to 7.0
V
#RESET
-0.3 to V
DD
+ 0.5
V
Output voltage
V
O
P00–07, P10–17, P20–24, P40–47, PD0–D4
-0.3 to V
DD
+ 0.5
V
P50–54
-0.3 to V
DD2
+ 0.5
V
High level output current
I
OH
1 pin
P00–07, P10–17, P20–24,
P40–47, PD0–D4
-10
mA
Total of all pins
-20
mA
1 pin
P50–54
-60
mA
Total of all pins
-60
mA
Low level output current
I
OL
1 pin
P00–07, P10–17, P20–24,
PD0–D4
-10
mA
Total of all pins
-20
mA
1 pin
P40–47, P50–54
10
mA
Total of all pins
60
mA
Operating temperature
Ta
-40 to 85
°
C
Storage temperature
Tstg
-65 to 125
°
C
19.2 Recommended Operating Conditions
(V
SS
= V
SS2
= 0 V)
*
1
Item
Symbol
Condition
Min.
Typ.
Max. Unit
Power supply voltage
V
DD
For normal operation
1.8
–
5.5
V
For Flash programming
2.4
–
5.5
V
V
DD2
1.8
–
5.5
V
Flash programming voltage
V
PP
7.3
7.5
7.7
V
OSC3 oscillator oscillation frequency
f
OSC3
Crystal/ceramic oscillator
1
–
16.8 MHz
EXOSC external clock frequency
f
EXOSC
When supplied from an external oscillator
0.016
–
16.8 MHz
Bypass capacitor between V
SS
and V
DD
C
PW1
–
3.3
–
µF
Bypass capacitor between V
SS2
and V
DD2
C
PW2
–
3.3
–
µF
Capacitor between V
SS
and V
D1
C
PW3
–
1
–
µF
Gate capacitor for OSC3 oscillator
C
G3
When the crystal/ceramic oscillator is used
*
2
0
–
100
pF
Drain capacitor for OSC3 oscillator
C
D3
When the crystal/ceramic oscillator is used
*
2
0
–
100
pF
DSIO pull-up resistor
R
DBG
*
3
–
10
–
k
W
Capacitor between V
SS
and V
PP
C
VPP
–
0.1
–
µF
*
1 The potential variation of the V
SS
voltage should be suppressed to within
±
0.3 V on the basis of the ground potential of the MCU
mounting board while the Flash is being programmed, as it affects the Flash memory characteristics (programming count).
*
2 The component values should be determined after performing matching evaluation of the resonator mounted on the printed
circuit board actually used.
*
3 R
DBG
is not required when using the DSIO pin as a general-purpose I/O port.
*
4 The component values should be determined after evaluating operations using an actual mounting board.