20 BASIC EXTERNAL CONNECTION DIAGRAM
S1C17M12/M13 TECHNICAL MANUAL
Seiko Epson Corporation
20-1
(Rev. 1.2)
20 Basic External Connection Diagram
COM4
COM3
COM2
COM1
COM0
EXSVD
n
P
xy
SDI
n
SDO
n
SPICLK
n
#SPISS
n
SCL0
SDA0
USIN0
USOUT0
TOUT00/CAP00
TOUT01/CAP01
ADIN00–07
#ADTRG0
VREFA0
DCLK
DSIO
DST2
V
PP
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
R
DBG
ICDmini
I/O
SPI
I
2
C
UART
PWM/Capture
V
DD
External voltage
S1C17M12/M13
[The potential of the substrate
(back of the chip) is V
SS
.]
(
)
C
VPP
A/D conversion inputs
REMO
V
DD2
IR transmitter module
V
DD
V
D1
OSC3
OSC4
#RESET
V
SS
V
DD2
V
SS2
C
PW3
C
PW1
+
C
D3
C
G3
( )
( )
X'tal3/
Ceramic
1.8–5.5 V
C
PW2
+
1.8–5.5 V
2.4–5.5 V
∗
1
∗
2
∗
3
*
1: For Flash programming
*
2: When OSC3 crystal/ceramic oscillator is selected
*
3: Available only in the S1C17M13
( ): Do not mount components if unnecessary.
Sample external components
Symbol
Name
Recommended components
X’tal3
Crystal resonator
CA-301 (4 MHz) manufactured by Seiko Epson Corporation
Ceramic Ceramic resonator
CSBLA_J (1 MHz) manufactured by Murata Manufacturing Co., Ltd.
C
G3
OSC3 gate capacitor
Ceramic capacitor
C
D3
OSC3 drain capacitor
Ceramic capacitor
C
PW1
Bypass capacitor between V
SS
and V
DD
Ceramic capacitor or electrolytic capacitor
C
PW2
Bypass capacitor between V
SS2
and V
DD2
Ceramic capacitor or electrolytic capacitor
C
PW3
Capacitor between V
SS
and V
D1
Ceramic capacitor
R
DBG
DSIO pull-up resistor
Thick film chip resistor
C
VPP
Capacitor between V
SS
and V
PP
Ceramic capacitor
*
For recommended component values, refer to “Recommended Operating Conditions” in the “Electrical Characteristics” chapter.