1 OVERVIEW
1-6
Seiko Epson Corporation
S1C17M12/M13 TECHNICAL MANUAL
(Rev. 1.2)
1.3.2 Pad Configuration Diagram (Chip)
1 2 3 4 5 6 7 8 9 10 11 12 13
14 15 16 17 18 19 20 21
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
33
32
31
30
29
28
27
26
25
24
23
22
45
44
43 42 41 40 39
38 37 36
35
34
Y
X
(0, 0)
2.00 mm
2.28 mm
P52 P52 P52 P52 V
DD2
P53 P53 P53 P53 P54 P54 P54 P54
P00 P01 P02 P03 P04 P05 P06 P07
P52/COM2 P52/COM2 P52/COM2 P52/COM2
V
DD2
P53/COM3 P53/COM3 P53/COM3 P53/COM3 P54/COM4 P54/COM4 P54/COM4 P54/COM4
P00/UPMUX P01/UPMUX P02/UPMUX P03/UPMUX P04/UPMUX P05/UPMUX P06/UPMUX P07/UPMUX
V
SS2
V
PP
P24 P23 P22 P21 P20
PD2 PD1 PD0
V
DD
#RESET
V
SS2
V
PP
P24/UPMUX P23/UPMUX P22/UPMUX P21/UPMUX P20/UPMUX
DCLK/PD2 DSIO/PD1 DST2/PD0
V
DD
#RESET
V
SS
V
D1
PD4
PD3
P17
P16
P15
P14
P13
P12
P11
P10
V
SS
V
D1
PD4/OSC4
PD3/OSC3
P17/UPMUX
P16/FOUT/UPMUX
P15/EXCL01/UPMUX
P14/EXCL00/UPMUX
P13/EXOSC/UPMUX
P12/UPMUX/EXSVD1
P11/UPMUX/EXSVD0
P10/UPMUX
Die No. CJxxxxxxx
∗
1
∗
1
∗
1
∗
1
∗
1
Pad
name
P40
P41
P42
P43
V
SS2
P44
P45
P46
P47
V
SS2
P50
P50
P50
P50
P51
P51
P51
P51
Port function
or signal
assignment
P40/SEG0
P41/SEG1
P42/SEG2
P43/SEG3
V
SS2
P44/SEG4
P45/SEG5
P46/SEG6
P47/SEG7
V
SS2
P50/REMO/COM0
P50/REMO/COM0
P50/REMO/COM0
P50/REMO/COM0
P51/CLPLS/COM1
P51/CLPLS/COM1
P51/CLPLS/COM1
P51/CLPLS/COM1
Figure 1.3.2.1 S1C17M12 Pad Configuration Diagram (Chip)
*
1 These pads have the same specification. Select one pad to be used.
Pad opening: X = 68 µm, Y = 68 µm
Chip thickness: 400 µm