NANOSYSTEM
FABRICATION
FACILITY
(NFF),
HKUST
Version
1.0
Page 4 of 18
2.2 Available Deposition Materials
The following sources are available in AST Peva-450I E-Beam Evaporation System.
AST Peva-450I: Al, Ti, Ni and Au
NOTE:
Consult a NFF EC staff member prior to do new materials other than above listed materials.
Hazardous
or
Radioactive
materials are not allowed to be deposited in AST Peva-450I.
2.3 Performance of the AST Peva-450I E-Beam Evaporation System
What the AST Peva-450I CAN do
It can provide thin films (
≤
3000A thick
) of various metal and semi-conductors
with precision measurement of film thickness via crystal monitoring.
It provides very directional evaporation particularly useful for lift-off metal
patterning.
It has a single vacuum chamber for
METAL
evaporation processes.
Deposition on up to 2” and 4” wafers at once.
Deposition on pieces, which are fixed to a 2” or 4” dummy via HB 836
Anti-static polyimide film silicone adhesive tape.
Deposition rate is fixed on 1A/s.
What the AST
Peva-450I
CANNOT do
Thick film deposition is not allowed because of too long processing time, wear
on the system, expense of materials, and adhesion issues with your sample.
Evaporation of dielectrics is not allowed.