TotalFlow XRC6490, User Manual

Page: 38 / 342

1-24
Key Pad, Cont.
FRONT VIEW WITH KEYPAD SIDE VIEW WITH KEYPAD
Figure 1–11 XRC6990 with Dual Keypads
Totalflow Input/Output Modules
In addition to Totalflow’s enhanced on-board input/output capabilities, the hardware
functionality of the XSeries can be extended in a flexible and friendly way by adding
modular I/O as needed (see
Figure 1–12
). Totalflow I/O (TFIO) modules are designed to
accommodate low power, harsh environment and economical cost requirements. The
system automatically recognizes the module types and configures the I/O Scanner
subsystem accordingly.
The modules are interfaced to the XRC-195 Board by an I2C bus. On top of this bus,
Totalflow has implemented an efficient I/O protocol to exchange information between the
modules and the XRC-195 Board. The bus operates in a master/slave mode, with the Main
Board acting as master.
The XRC6490 (as shown in Figure 1–13) systems support up to 3 modules. For example, 3
analog input modules can be connected to the I2C bus. Since each module supports 8
analog inputs, then a total of 24 analog inputs can be added to the I2C bus. The XRC6790
(as shown in
Figure 1–14
) systems support up to 6 modules. The XRC6890 (see
Figure 1–
15
) supports upto 14 and XRC6990 (see
Figure 1–16
) support up to 6 per XRC Board.
The I/O module hardware is packaged in DIN mount enclosures that employ Phoenix
contact technology for field wiring. The modules also interconnect with each other to
provide the necessary power and interface signals along their bus. Installation consists of
snapping the Phoenix connector onto the DIN rail and moving the module into position
directly beside and snapped to the next module. Likewise, in removing a module, it must
first be separated from the module on either side, then removed from the DIN rail.
For additional information, please refer to the TFIO Module User’s Manual (Part
No.2101226-001).
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