MSP430G2955
MSP430G2855
MSP430G2755
SLAS800 – MARCH 2013
www.ti.com
RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
(RAMh)
RAM retention supply voltage
(1)
CPU halted
1.6
V
(1)
This parameter defines the minimum supply voltage V
CC
when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
V
CC
MIN
TYP
MAX
UNIT
f
SBW
Spy-Bi-Wire input frequency
2.2 V
0
20
MHz
t
SBW,Low
Spy-Bi-Wire low clock pulse duration
2.2 V
0.025
15
µs
t
SBW,En
Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge
(1)
)
2.2 V
1
µs
t
SBW,Ret
Spy-Bi-Wire return to normal operation time
2.2 V
15
100
µs
f
TCK
TCK input frequency
(2)
2.2 V
0
5
MHz
R
Internal
Internal pulldown resistance on TEST
2.2 V
25
60
90
k
Ω
(1)
Tools accessing the Spy-Bi-Wire interface need to wait for the maximum t
SBW,En
time after pulling the TEST/SBWTCK pin high before
applying the first SBWTCK clock edge.
(2)
f
TCK
may be restricted to meet the timing requirements of the module selected.
JTAG Fuse
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
CC(FB)
Supply voltage during fuse-blow condition
T
A
= 25°C
2.5
V
V
FB
Voltage level on TEST for fuse blow
6
7
V
I
FB
Supply current into TEST during fuse blow
100
mA
t
FB
Time to blow fuse
1
ms
(1)
Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to
bypass mode.
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