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Service Guide ML320/ML321
Chapter 4 Failure & Repair Analysis
4.1.01 Introduction
This section is used to isolate problems to the assembly level. Application problems and
detection of faulty components on the printed circuit boards are not addressed.
When troubleshooting a defective unit, refer first to Section 4.4 of this Service Handbook.
This section contains tips on preventing problems as well as a list of common problems.
Next, refer to Section 4.6. Repair Analysis Procedures (RAPs) will ask you questions or
require you to make observations. The answers to these questions and the results of
your observations determine your next course of action. Use the RAP Index to identify
which RAP should be used to resolve the problem with the machine.
If you encounter a situation that is not addressed by the documentation in this kit,
please report the problem to Okidata. Send your report to the Okidata Technical
Training Group. Refer to the Service Center Reference Guide for information on
contacting Okidata.
The following information is provided to detect and analyze failures.
Okilink II, Faxable Facts, Technical Service Bulletins
Troubleshooting Tips / Common Problems
Fault Alarms
Repair Analysis Procedures
Hexadecimal Dump
Resistance / Service Checks
Tests
Menu Operation
Top of Form
Paper Park
Serial Number Identification & (A-D) Revision Levels
A
Rev A units are original production units. An interconnect module connects the power supply board
to the main control board.
B
Rev B units are retrofitted to include a modified interconnect module, which prevents corrosion.
C
Rev C units have a cable harness connection between the power supply board and the main control
board. The cable harness replaces the interconnect module.
D
Rev D units have no power supply board. The circuitry for the power supply board has been
incorporated on the main control board.
