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ML7065-033 User’s Manual
Chapter 9 Package Dimensions
69
9. Package Dimensions
P-VQFN48-0707-0.50
Package material
Epoxy resin
Lead frame material
Cu alloy
Lead finish
Sn/Bi = 98/2
Pin treatment
Solder plating (7 to 18 µm)
Package weight (g)
0.095 TYP.
5
Rev. No./Last Revised
Preliminary
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package
name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
(Unit: mm)