M68HC16 Z SERIES
ELECTRICAL CHARACTERISTICS
USER’S MANUAL
A-11
17
MC68CM16Z1/Z4 Power Dissipation
11
P
D
—
191
mW
18
Input Capacitance
All input-only pins
All input/output pins
C
in
—
—
10
20
pF
19
Load Capacitance
Group 1 I/O Pins, CLKOUT, FREEZE/QUOT, IPIPE0
Group 2 I/O Pins and CSBOOT, BG/CS
Group 3 I/O Pins
Group 4 I/O Pins
C
L
—
—
—
—
90
100
100
100
pF
NOTES:
1. Applies to:
Port ADA [7:0] — AN[7:0]
Port E [7:4] — SIZ[1:0], AS, DS
Port F [7:0] — IRQ[7:1], MODCLK
Port GP[7:0] — IC4/OC5/OC1, IC[3:1], OC[4:1]/OC1
Port MCCI[7:0] — TXD, PCS[3:1], PCS0/SS, SCK, MOSI, MISO
BKPT/DSCLK, DSI/IPIPE1, PAI, PCLK, RESET, RXD, TSC
2. Input-Only Pins: EXTAL, TSC, BKPT/DSCLK, PAI, PCLK, RXD
Output-Only Pins: CSBOOT, BG/CS1, CLKOUT, FREEZE/QUOT, DSO/IPIPE0, PWMA, PWMB
Input/Output Pins:
Group 1: Port GP[7:0] — IC4/OC5/OC1, IC[3:1], OC[4:1]/OC1, DATA[15:0], DSI/IPIPE1
Group 2: Port C[6:0] — ADDR[22:19]/CS[9:6], FC[2:0]/CS[5:3]
Port E[7:0] — SIZ[1:0], AS, DS, AVEC, DSACK[1:0]
Port F[7:0] — IRQ[7:1], MODCLK
Port MCCI[7:3] — TXD, PCS[3:1], PCS0/SS, ADDR23/CS10/ECLK
Group 3: HALT, RESET
Group 4: MISO, MOSI, SCK
3. Does not apply to HALT and RESET because they are open drain pins.
Does not apply to port MCCI[7:0] (TXD, PCS[3:1], PCS0/SS, SCK, MOSI, MISO) in wired-OR mode.
4. Use of an active pulldown device is recommended.
5. Total operating current is the sum of the appropriate I
DD
, I
DDSYN
, I
SB
, and I
DDA
.
6. Current measured with system clock frequency of 16.78 MHz, all modules active.
7. This parameter is periodically sampled rather than 100% tested.
8. CPU16 in WAIT, all other modules inactive.
9. The RAM module will not switch into standby mode as long as V
SB
does not exceed V
DD
by more than 0.5 Volt.
The RAM array cannot be accessed while the module is in standby mode.
10. When V
DD
is transitioning during a power up or power down sequence, and V
SB
is applied, current flows between
the V
STBY
and V
DD
pins, which causes standby current to increase toward the maximum transient condition spec-
ification. System noise on the V
DD
and V
STBY
pins can contribute to this condition.
11. Power dissipation measured at specified system clock frequency, all modules active. Power dissipation can be
calculated using the expression:
P
D
= Maximum V
DD
(I
DD
+ I
DDSYN
+ I
SB
) + Maximum V
DDA
(I
DDA
)
I
DD
includes supply currents for all device modules powered by V
DD
pins.
Table A-11 Low Voltage 16.78-MHz DC Characteristics (Continued)
(V
DD
and V
DDSYN
= 2.7 to 3.6Vdc, V
SS
= 0 Vdc, T
A
= T
L
to T
H
)
Num
Characteristic
Symbol
Min
Max
Unit
F
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S
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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