HP Pavilion 2159m, Maintenance And Service Manual

Page: 51 / 110

Heat sink assembly
NOTE: The heat sink assembly spare part kits include replacement thermal materials.
Description Spare part number
Heat sink for use in models with discrete graphics in the Carrizo-L and Beema chipsets 806760-001
Heat sink for use in models with discrete graphics in the Carrizo chipset 809105-001
Heat sink for use in models with UMA graphics in the Carrizo-L and Beema chipsets 806759-001
Heat sink for use in models with UMA graphics in the Carrizo chipset 809104-001
NOTE: To properly ventilate the computer, allow at least 7.6 cm (3.0 in) of clearance on the left side of the
computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor
and is designed to turn on automatically when high temperature conditions exist. These conditions are
affected by high external temperatures, system power consumption, power management/battery
conservation configurations, battery fast charging, and software requirements. Exhaust air is displaced
through the ventilation grill located on the left side of the computer.
Before removing the heat sink assembly, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and
then unplugging the AC adapter from the computer.
4. Remove the battery (see Battery on page 29 ).
5. Remove the optical drive (see Optical drive on page 30 ).
6. Remove the bottom cover (see Bottom cover on page 34 ).
To remove the heat sink assembly:
1. Position the system board upside down.
Component replacement procedures 43