Pin Name
Type
Description
SI
I
Internal RF Transceiver Slave SPI Serial Data Input Signal
Internally connected to the MCU Master SPI SDO output signal
SO
O
Internal RF Transceiver Slave SPI Serial Data Output Signal
Internally connected to the MCU Master SPI SDI input signal
SCLK
I
Internal RF Transceiver Slave SPI Serial Clock Input Signal
Internally connected to the MCU Master SPI SCK output signal
SEN
I
Internal RF Transceiver Slave SPI Serial interface Enable Input Signal
Internally connected to the MCU Master SPI SCS output signal
INT
I
Internal RF Transceiver Interrupt Output Signal
Internally connected to the MCU INT input signal
RST
I
Internal RF Transceiver global hardware reset input signal, active low.
Internally connected to the MCU I/O pin configured as output type.
NC
¾
Implies that the pin is
²
Not Connected
²
and can therefore not be used.
Notes: (1) Connecting bypass capacitor(s) as close to the pin as possible.
(2) The pin descriptions for all external pins except the RF Transceiver pins listed in the above table are de-
scribed in the preceding MCU section.
(3) The INT and RST lines are internally connected to the MCU I/O pins PC2 and PC3 respectively for the
HT82M75REW and HT82K75REW devices.
Absolute Maximum Ratings
Supply Voltage ...........................V
SS
-
0.3V to V
SS
+6.0V
Storage Temperature ............................
-
50
°
C to 125
°
C
Input Voltage..............................V
SS
-
0.3V to V
DD
+0.3V
Operating Temperature...........................
-
40
°
C to 85
°
C
I
OL
Total ..............................................................150mA
I
OH
Total............................................................
-
100mA
Total Power Dissipation .....................................500mW
Note: These are stress ratings only. Stresses exceeding the range specified under
²
Absolute Maximum Ratings
²
may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Ta=25
°
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
DD
Conditions
V
BAT
BAT_IN Operating Voltage
¾
¾
1.8
2.2
3.3
V
I
DD
Operating Current (Crystal OSC)
3V
No load, f
SYS
= 6MHz
¾
3
6
mA
I
STB
Standby Current
¾
No load, system HALT
WDT disable, LVR disable
¾
¾
20
m
A
V
IL1
Input Low Voltage for I/O
(Schmitt Trigger)
¾
¾
0
¾
0.3V
DD
V
V
IH1
Input High Voltage for I/O
(Schmitt Trigger)
¾
¾
0.7V
DD
¾
V
DD
V
V
IL2
Input Low Voltage (RES)
¾
¾
0
¾
0.3V
DD
V
V
IH2
Input High Voltage (RES)
¾
¾
0.9V
DD
¾
V
DD
V
I
OL1
Other I/O Pins Sink Current
3V
V
OL
=0.1V
DD
4
¾
¾
mA
I
OH1
Other I/O Pins Source Current
3V
V
OH
=0.9V
DD
-
2.5
-
4.5
¾
mA
R
PH1
Other Pins Internal Pull-high
Resistance
3V
¾
10
30
50
k
W
HT82M75REW/HT82K75REW
Rev. 1.00
5
June 11, 2010
electronic components distributor