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VersaMax® Modules, Power Supplies, and Carriers User's Manual – March 2003
GFK-1504K
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Thermal Considerations
The thermal performance specified for modules in this manual requires a clearance
of 2 inches (5.1cm) above and below the modules and 1 inch (2.54cm) on each side
of the modules as shown below, regardless of the orientation of the DIN rail.
5.1cm
(2.0in)
2.54cm
(1.0in)
5.1cm
(2.0in)
2.54cm
(1.0in)
5.1cm
(2.0in)
2.54cm
(1.0in)
5.1cm
(2.0in)
2.54cm
(1.0in)
CPU or NIU
at Bottom
Mounting Modules on a Vertical DIN Rail
When using a vertical DIN rail, the CPU or NIU module must be installed at the
bottom.
Some VersaMax I/O modules require thermal derating. The “Thermal Derating”
section of these modules’ descriptions provides specific derating information. In
general, mounting a module on a vertical DIN rail increases the ambient temperature
around each module, due to the cumulative effect of the rising heat. Therefore,
modules that have a thermal derating when mounted on a horizontal DIN rail will
have a greater derating when mounted on a vertical DIN rail
Modules that do not have a thermal derating when mounted on a horizontal DIN rail
also have no derating when installed on a vertical DIN rail.
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