
OPERATION
28
(0.5 ADC). The signal outputs are provided on the 9 pin female type D connector. Below
is a listing that indicates what conditions activate each pin. When a terminal becomes
active the relay closes thereby allowing the external voltage to operate an external device.
Pins 1 and 2 provide the PASS signal.
Pins 3 and 4 provide the FAIL signal.
Pins 5 and 6 provide the PROCESSING signal.
Pins 7 and 8 provide the RESET OUT signal.
Pins 7 and 9 provide the START OUT pulse signal.
The following describes how the relays operate for each test condition.
PROCESSING - The relay contact closes the connection between pin (5) and pin (6)
while the instrument is performing a test. The connection is opened at the end of the test.
PASS - The relay contact closes the connection between pin (1) and pin (2) after
detecting that the item under test passed all tests. The connection is opened when the next
test is initiated or the reset function is activated.
FAIL - The relay contact closes the connection between pin (3) and pin (4) after detecting
that the item under test failed any test. The connection is opened when the next test is
initiated or the reset function is activated.
RESET OUT - The relay contact closes the connection between pin (7) and pin (8) while
the reset function is activated. This is only a continuous closure dependent on the length
of time the reset button is held in an active state.
START OUT - The relay contact closes the connection between pin (7) and pin (9)
momentarily after the completion and pass of the Ground Bond test. This is only a
momentary closure, and therefore, the contact does not stay closed.
With the HYAMP jr. and the Hypot II being used as a test system, the processing signal
from the Hipot tester will be sent across pin (6) and pin (7) of the HYAMP jr. remote
input. This signal will add to the LCD display a W-On Withstand Processing indicator
that notifies the operator that high voltage is enabled.
E. HYAMP jr. AND Hypot II INTERCONNECTION:
The two instruments have been designed to interface and work as one test system. The
tests may be performed in sequence, where the Ground Bond test is run to verify the
ground integrity and then the Hipot test is run after a good ground is indicated. The two
tests can also be run simultaneously. Instructions regarding connections are provided in
the next section. Also, refer to the end of section
E
for a complete diagram of a basic test
setup.
After configuring the required test parameters for both instruments and connecting the
cables, the test cycle can be initiated by activating the front panel test button on HYAMP
Summary of Contents for 3030D
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