SERIES APZU+ ACROPACK
USER’S MANUAL
Acromag, Inc. Tel: 248-295-0310
- 5 -
www.acromag.com
disposition of this product after its service life must be conducted in
accordance with applicable country, state, or local laws or regulations.
1.3 AcroPack Information – All Models
The AcroPack IO module are based on the PCI Express Mini Card
Electromechanical specification and are 70mm in length with an added 100
pin field I/O connector.
The AcroPack is 19.05mm longer than the full length mini PCIe card at
50.95mm. It has the same mPCIe board width of 30mm and uses the same
mPCIe standard board hold down standoff and screw keep out areas.
The APZU+ module is a Xilinx Zynq base module the has FPGA fabric
available for parallel computing applications. The key information resulting
from the parallel processing can then be passed to the ARM processing
system for further manipulation and processing.
The APZU+ utilizes state of the art Surface-Mounted Technology (SMT) to
achieve its wide functionality and is an ideal choice for a wide range of
industrial I/O applications that require a high-density, highly reliable, high-
performance interface at a low cost.
1.3.1 Ordering Information
The AcroPack ordering options are given in the following table.
Model Number
Description
Zynq I/O Bank
APZU-301
1
28 TTL I/O
1.8 volt HP Bank 65
APZU-303
1
20 TTL & 3 RS485/422
3.3 volt HD Bank 26
APZU-304
1
14 LVDS I/O
1.8 volt HP Bank 65
Note 1
: Operating temperature range for models:
-40
o
C
to 75
o
C.
1.3.2 Key Features
Zynq UltraScale Plus device XCZU3CG
o
Dual-core ARM Cortex-A53 Processing Unit
1.5GHz CPU
Single/double precision Floating Point Unit
o
Dual-core ARM Cortex-R5 Real-Time processor system
