V-TEK Royce DE35-ST, Руководство пользователя

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DE35-ST Operating Instructions
D292469I 95
Die Underside Inspection
Systems equipped with the Underside Inspection Camera have the option to view the
bottom of the die before placement, allowing the operator to observe any defects in the
back side of the diode to include impurities, damage and voids.
After inspection the operator is given several different placement locations to choose
from:
• Up to 5 locations including a discard option when using 2 inch waffle packs
• Up to 3 locations including a discard option when using 4 inch waffle packs.
In RUN mode with the Underside Inspection option selected, the normal pick and place
cycle is interrupted immediately following the die being picked. The arm stops over the
Underside Inspection Camera and the head is lowered to bring the die into focus. The
Operator can now look at the bottom of the die and choose the category the die should
be packaged as, or discard it if damaged.
Optics are optimized for the customer’s die size. The image is displayed on the Main
Targeting Monitor when the die is in place over the lens.
NOTE:
This height can be adjusted for optimal performance. The LCD will then
display the optional locations to place the die
Adjust Pickup Tip Height at Underside Inspection
1. Adjust Pickup Tip Height
a. Place the system in Single Step Mode by pressing the
SINGLE STEP
key.
b. Cycle the system until the Pickup is at the down position over the
Underside Inspection Camera.
c. Press the
UP/DOWN
keys to adjust the pickup height.
d. Press the LEFT/RIGHT Arrow keys to adjust Pickup Tip position
accordingly.
Underside Inspection
of a 300 um die.